Lens Driving Device, and Camera Module and Optical Device Including Same

ABSTRACT

An embodiment includes: a base; a circuit board which is disposed on the base and which includes first and second terminals; a housing disposed on the circuit board; a bobbin disposed in the housing; a first coil disposed on the bobbin; a sensing magnet disposed on the bobbin; a magnet disposed in the housing; a first position sensor which is disposed in the housing and which corresponds to the sensing magnet; a second coil disposed between the base and the magnet; and a second position sensor which is disposed on the circuit board and which includes a first sensor and a second sensor, wherein each of the first sensor and the second sensor is a driver integrated circuit including a hall sensor and a driver, a clock signal is provided to the first terminal of the circuit board, a data signal is provided to the second terminal of the circuit board, and the driver of each of the first position sensor, the first sensor, and the second sensor transmits/receives the clock signal through the first terminal of the circuit board, and transmits/receives the data signal in a time-division manner through the second terminal of the circuit board.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is the U.S. national stage application of InternationalPatent Application No. PCT/KR2020/003839, filed Mar. 20, 2020, whichclaims the benefit under 35 U.S.C. § 119 of Korean Application Nos.10-2019-0032500, filed Mar. 21, 2019; and 10-2019-0041819, filed Apr.10, 2019, the disclosures of each of which are incorporated herein byreference in their entirety.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus and a camera module and anoptical device each including the same.

BACKGROUND ART

It is difficult to apply technology of a voice coil motor (VCM) used inexisting general camera modules to a subminiature, low-power cameramodule, and therefore research related thereto has been activelyconducted.

Demand for and production of electronic products, such as smartphonesand mobile phones equipped with cameras have increased. Cameras formobile phones are trending toward increased resolution andminiaturization. As a result, an actuator has also been miniaturized,increased in diameter, and been made multifunctional. In order torealize a high-resolution camera for mobile phones, improvement inperformance of the camera for mobile phones and additional functionsthereof, such as autofocusing, handshake correction, and zooming, arerequired.

DISCLOSURE Technical Problem

Embodiments provide a lens moving apparatus and a camera module and anoptical device each including the same, which are capable of increasingthe length of a support member without increasing the height thereof andthus of improving reliability and reducing power consumption.

Furthermore, the embodiments provide a camera device and an opticaldevice, which are capable of blocking light, which is incident through aside surface of a filter, and thus of inhibiting the occurrence of aflaring phenomenon.

Technical Solution

A lens moving apparatus according to an embodiment includes a base, acircuit board, which is disposed on the base and includes first andsecond terminals, a housing disposed on the circuit board, a bobbindisposed in the housing, a first coil disposed on the bobbin, a sensingmagnet disposed on the bobbin, a magnet disposed on the housing, a firstposition sensor disposed on the housing so as to correspond to thesensing magnet, a second coil disposed between the base and the magnet,and a second position sensor including first and second sensors, whichare conductively connected to the circuit board, wherein each of thefirst and second sensors is a driver IC (Integrated Circuit) including aHall sensor and a driver, wherein the first terminal of the circuitboard is provided with a clock signal and the second terminal of thecircuit board is provided with a data signal, wherein the driver of eachof the first position sensor, the first sensor and the second sensortransmits and receives the clock signal through the first terminal ofthe circuit board and transmits and receives the data signal through thesecond terminal of the circuit board, wherein the data signal includes afirst data signal for the first position sensor, a second data signalfor the first sensor and a third data signal for the second sensor, andwherein the first data signal, the second data signal and the third datasignal are transmitted and received through the second terminal in atime-division manner.

The circuit board may further include third and fourth terminals, andthe driver of each of the first position sensor, the first sensor andthe second sensor may be provided with a power signal through the thirdand fourth terminals.

The power signal may include a first voltage, which is supplied to thethird terminal, and a second voltage, which is supplied to the fourthterminal and is higher than the first voltage.

The driver of each of the first position sensor, the first sensor andthe second sensor may use data communication using a protocol wherein,in the data communication, the drivers of the first position sensor, thefirst sensor and the second sensor may be identified by differentaddresses, and the data signal may be transmitted and received to andfrom one of the first position sensor, the first sensor and the secondsensor based on the different addresses.

The magnet may include a first magnet and a second magnet, and thesecond coil may include a first coil unit corresponding to the firstmagnet and a second coil unit corresponding to the second magnet.

The driver of the first sensor may provide the first coil unit with afirst drive signal, and the driver of the second sensor may provide thesecond coil unit with a second drive signal.

The driver of the first sensor may provide the first coil unit with thefirst drive signal through the circuit board, and the driver of thesecond sensor may provide the second coil unit with the second drivesignal through the circuit board.

The driver of the first position sensor may provide the first coil witha drive signal.

The lens moving apparatus may further include first and second elasticmembers coupled both to the bobbin and to the housing, wherein the firstcoil may be coupled to the first and second elastic members, and thedrive signal may be supplied to the first coil through the first andsecond elastic members.

A lens moving apparatus according to another embodiment includes a base,a circuit board, which is disposed on the base and includes first andsecond terminals, a housing disposed on the circuit board, a bobbindisposed in the housing, a first coil disposed on the bobbin, a magnetdisposed on the housing, a second coil disposed between the base and themagnet, and first and second sensors conductively connected to thecircuit board, wherein each of the first and second sensors is a driverIC (Integrated Circuit) including a Hall sensor and a driver, whereinthe first terminal of the circuit board is provided with a clock signaland the second terminal of the circuit board is provided with a datasignal, and wherein the driver of each of the first sensor and thesecond sensor transmits and receives the clock signal through the firstterminal of the circuit board and transmits and receives the data signalthrough the second terminal of the circuit board in a time-divisionmanner.

A camera module according to an embodiment includes the lens movingapparatus and a controller, wherein the controller performs an AFoperation of controlling movement of the lens moving apparatus in adirection of an optical axis using the first data signal, and performsan OIS operation of controlling movement of the lens moving apparatus ina direction perpendicular to the optical axis using the second and thirddata (signals).

Advantageous Effects

Embodiments are able to increase the length of the support memberwithout increasing the height thereof and thus to improve reliabilityand reduce power consumption.

Furthermore, embodiments are able to reduce a phenomenon in whichcontaminants outside a filter enters the filter by applying epoxy to thefilter and a sensor base. Consequently, it is possible to minimize theincidence of spots on an image, which is caused by entry of thecontaminants into the filter.

DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded perspective view of a lens moving apparatusaccording to an embodiment;

FIG. 2 is an assembled perspective view of the lens moving apparatusshown in FIG. 1, from which a cover member is removed;

FIG. 3A is a perspective view of the bobbin, the second magnet and thethird magnet shown in FIG. 1;

FIG. 3B is a view illustrating the first coil coupled to the bobbin;

FIG. 4A is a perspective view of the housing, the circuit board, theposition sensor, and the capacitor, which are shown in FIG. 1;

FIG. 4B is an assembled perspective view of the housing, the firstmagnet, the circuit board, the first position sensor, and the capacitor;

FIG. 5 is a cross-sectional view of the lens moving apparatus, takenalong line A-B in FIG. 2;

FIG. 6 is a cross-sectional view of the lens moving apparatus, takenalong line C-D in FIG. 2;

FIG. 7 is a cross-sectional view of the lens moving apparatus, takenalong line E-F in FIG. 2;

FIG. 8A is an enlarged view of the circuit board and the first positionsensor;

FIG. 8B is a schematic view of an embodiment of the first sensor shownin FIG. 8A;

FIG. 9A is a view illustrating the upper elastic member shown in FIG. 1;

FIG. 9B is a view illustrating the lower elastic member shown in FIG. 1;

FIG. 10 is an assembled perspective view of the upper elastic member,the lower elastic member, the base, the support member, the second coil,the circuit board and the second position sensor;

FIG. 11A is a view illustrating the coupling relationship between thefirst to fourth terminals of the circuit board and the upper elasticunits;

FIG. 11B is a bottom view of the fifth and sixth terminals of thecircuit board and the lower elastic units;

FIG. 12A is an exploded perspective view of the second coil, the circuitboard, the base, and the second position sensor;

FIG. 12B is an assembled perspective view of the second coil, thecircuit board, the base, and the second position sensor;

FIG. 13 is a plan view of the base, the circuit board, and the first andsecond sensors;

FIG. 14 is a plan view of the base, the circuit board, the first andsecond sensors, and the second coil 230;

FIG. 15 is a cross-sectional view of the components shown in FIG. 15,taken along line G-H;

FIG. 16A is a block diagram illustrating the supply of power signals, adata signal and a clock signal to the first position sensor, the firstsensor and the second sensor according to an embodiment;

FIG. 16B is a circuit diagram of the first position sensor, the firstsensor and the second sensor shown in FIG. 16A;

FIG. 17A is a block diagram illustrating the supply of the powersignals, the data signal and the clock signal to the first positionsensor, the first sensor and the second sensor according to anotherembodiment;

FIG. 17B is a circuit diagram of the first position sensor, the firstsensor and the second sensor shown in FIG. 17A;

FIG. 18 is a block diagram illustrating the supply of the power signals,the data signal and the clock signal of the first position sensor, thefirst sensor and the second sensor according to another embodiment;

FIG. 19 illustrates magnets, second coils, the first sensor, and thesecond sensor according to another embodiment;

FIG. 20 is an exploded perspective view illustrating a camera moduleaccording to an embodiment;

FIG. 21 is a perspective view of a camera device according to anotherembodiment;

FIG. 22 is an exploded perspective view of the camera device shown inFIG. 21;

FIG. 23 is an exploded perspective view of a lens moving apparatusaccording to an embodiment;

FIG. 24 is a perspective view of some components of the camera deviceaccording to the embodiment;

FIG. 25 is a cross-sectional view taken along line A-A in FIG. 24;

FIG. 26 is a cross-sectional view taken along line B-B in FIG. 24;

FIG. 27 is a cross-sectional view taken along line C-C in FIG. 24;

FIG. 28 is an exploded perspective view of some components of the cameradevice according to the embodiment;

FIG. 29 is an exploded bottom perspective view of some components of thecamera device according to the embodiment;

FIG. 30 is a cross-sectional view of some components of the cameradevice according to a modification;

FIG. 31 is a perspective view of a portable terminal according to anembodiment;

FIG. 32 is a view illustrating the configuration of the portableterminal illustrated in FIG. 31;

FIG. 33A is a block diagram of a portable terminal according to anembodiment; and

FIG. 33B is a block diagram of a portable terminal according to anotherembodiment.

BEST MODE

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings.

The technical idea of the present invention may be embodied in manydifferent forms, and should not be construed as being limited to thefollowing embodiments set forth herein. One or more of components of theembodiments may be selectively combined with each other or replacedwithout departing from the technical spirit and scope of the presentinvention.

Unless otherwise particularly defined, terms (including technical andscientific terms) used in the embodiments of the present invention havethe same meanings as those commonly understood by one of ordinary skillin the art to which this invention belongs. It will be furtherunderstood that commonly used terms, such as those defined indictionaries, should be interpreted as having meanings consistent withtheir meanings in the context of the relevant art.

The terminology used in the embodiments of the present invention is forthe purpose of describing particular embodiments only, and is notintended to limit the present invention. As used in the disclosure andthe appended claims, the singular forms are intended to include theplural forms as well, unless the context clearly indicates otherwise.The phrase “at least one (or one or more) of A, B and C” may beinterpreted as including one or more of all combinations of A, B and C.

Furthermore, when describing the components of the present invention,terms such as “first”, “second”, “A”, “B”, “(a)” or “(b)” may be used.Since these terms are provided merely for the purpose of distinguishingthe components from each other, they do not limit the nature, sequenceor order of the components.

It should be understood that, when an element is referred to as being“linked”, “coupled” or “connected” to another element, the element maybe directly “linked”, “coupled” or “connected” to the another element,or may be “linked”, “coupled” or “connected” to the another element viaa further element interposed therebetween. Furthermore, it will beunderstood that, when an element is referred to as being formed “on” or“under” another element, it can be directly “on” or “under” the otherelement, or can be indirectly disposed with regard thereto, with one ormore intervening elements therebetween. In addition, it will also beunderstood that “on” or “under” the element may mean an upward directionor a downward direction based on the element.

Hereinafter, the lens moving apparatus may be alternatively referred toas a “lens moving unit”, a “VCM (Voice Coil Motor)”, an “actuator” or a“lens moving device”. Hereinafter, the term “coil” may beinterchangeably used with “coil unit”, and the term “elastic member” maybe interchangeably used with “elastic unit” or “spring”.

In the follow description, the “terminal” may be alternatively referredto as a “pad”, “electrode”, “conductive layer” or “bonding portion”.

For the convenience of description, although the lens moving apparatusaccording to an embodiment is described using a rectangular coordinatesystem (x, y, z), the lens moving apparatus may be described using someother coordinate systems, and the embodiments are not limited thereto.In the respective drawings, the X-axis direction and the Y-axisdirection mean directions perpendicular to an optical axis, i.e. theZ-axis. The Z-axis direction, which is the direction of the optical axisOA, may be referred to as a “first direction”, the X-axis direction maybe referred to as a “second direction”, and the Y-axis direction may bereferred to as a “third direction”.

The lens moving apparatus according to an embodiment of the presentinvention is capable of performing an “auto-focusing function”. Here,the “auto-focusing function” serves to automatically focus an image of asubject on an image sensor surface.

In addition, the lens moving apparatus according to the embodiment mayperform a function of “handshake correction”. Here, the function of“handshake correction” may serve to inhibit the contour line of acaptured image from being blurred due to vibration caused by shaking ofthe user's hand when capturing a still image.

FIG. 1 is an exploded perspective of the lens moving apparatus 100according to an embodiment of the present invention. FIG. 2 is anassembled perspective view of the lens moving apparatus 100, from whicha cover member 300 in FIG. 1 is removed.

Referring to FIGS. 1 and 2, the lens moving apparatus 100 includes abobbin 110, a first coil 120, a first magnet 130, a housing 140, anupper elastic member 150, a lower elastic member 160, a first positionsensor 170, an circuit board 190 and a second magnet 180.

In order to perform handshake correction, the lens moving apparatus 100may include a support member 220, a second coil 230 and a secondposition sensor 240.

The lens moving apparatus 100 may further include a third magnet 185, abase 210, a circuit board 250 and a cover member 300.

The lens moving apparatus 100 may further include a capacitor 195mounted on the circuit board 190.

First, the bobbin 110 will be described.

The bobbin 110 may be disposed in the housing 140 so as to be movable inthe optical-axis direction OA or the first direction (for example, theZ-axis direction) by the electromagnetic interaction between the firstcoil 120 and the magnet 130.

FIG. 3A is a perspective view of the bobbin 110, the second magnet 180and the third magnet 185, which are shown in FIG. 1. FIG. 3B illustratesthe first coil coupled to the bobbin 110.

Referring to FIGS. 3A and 3B, the bobbin 110 may have a bore in which alens or a lens barrel is mounted. For example, the bore in the bobbin110 may be a through hole formed through the bobbin 110 in theoptical-axis direction, and may have a circular shape, an ellipticalshape or a polygonal shape, without being limited thereto.

Although the bore in the bobbin 110 may be directly provided thereinwith a lens, the disclosure is not limited thereto. In anotherembodiment, a lens barrel, to which at least one lens is mounted orcoupled, may be coupled or mounted in the bore in the bobbin 110. Thelens or the lens barrel may be coupled to the inner circumferentialsurface 110 a of the bobbin 110 in any of various ways.

The bobbin 110 may include first side portions 110 b-1, which are spacedapart from each other, and second side portions 110 b-2. Each of thesecond side portions 110 b-2 may connect two adjacent first sideportions to each other. For example, the horizontal or crosswise lengthof each of the first side portions 110 b-1 of the bobbin 110 may bedifferent from the horizontal or crosswise length of each of the secondside portions 110 b-2 of the bobbin 110.

The bobbin 110 may include a projection 115 a provided on the outersurface thereof. For example, although the projection 115 may bedisposed on the outer surface of the second side portions 110 b-2 of thebobbin 110, the disclosure is not limited thereto. The projection 115may project in a direction that extends through the center of the borein the bobbin and is parallel to a line perpendicular to the opticalaxis, but the disclosure is not limited thereto.

The projection 115 of the bobbin 110 may correspond to a groove 25 a inthe housing 140, and may be disposed in the groove 25 a in the housing140 so as to minimize or inhibit rotation of the bobbin 110 about theoptical axis beyond a predetermined range.

Furthermore, the projection 115 may serve as a stopper for minimizing orinhibiting direct collision of the lower surface of the bobbin 110 withthe base 210, the second coil 230 or the circuit board 250 even when thebobbin 110 is moved beyond a predetermined range in the optical-axisdirection (for example, in a direction toward the lower elastic member160 from the upper elastic member 150) due to external impact or thelike.

The bobbin 110 may have formed in the upper surface thereof a firstescape groove 112 a for avoiding spatial interference with a first frameconnector 153 of the upper elastic member 150. Although the first escapegroove 112 a may be formed, for example, in the second side portions 110b-2 of the bobbin 110, the disclosure is not limited thereto.

The upper surface of the bobbin 110 may be provided with a guide portion111 for guiding the mounting position of the upper elastic member 150.As illustrated in FIG. 3A, for example, the guide portion 111 of thebobbin 110 may be disposed in the first escape groove 112 a in order toguide the path along which the first frame connector 153 of the upperelastic member 150 extends. For example, the guide portion 111 mayproject from the bottom surface of the first escape groove 112 a in theoptical-axis direction.

The bobbin 110 may include a stopper 116 projecting from the uppersurface of the bobbin 110.

The stopper 116 of the bobbin 110 may serve to inhibit the upper surfaceof the bobbin 110 from directly colliding with the inner side of theupper plate of the cover member 300 even when the bobbin 110 is movedbeyond a specified range due to an external impact or the like while thebobbin 110 is being moved in the first direction to perform anauto-focusing function.

The bobbin 110 may include first couplers 113, which are intended to becoupled and secured to the upper elastic member 150. Although each ofthe first couplers 113 of the bobbin 110 shown in FIG. 3A is configuredto have a protrusion shape, the disclosure is not limited thereto. Inanother embodiment, each of the first couplers 113 of the bobbin 110 maybe configured to have the shape of a groove or a flat surface.

The bobbin 110 may include second couplers 117, which are intended to becoupled and secured to the lower elastic member 160. Although each ofthe second couplers 117 of the bobbin 110 shown in FIG. 3B is configuredto have a protrusion shape, the disclosure is not limited thereto. Inanother embodiment, each of the second couplers of the bobbin 110 may beconfigured to have a groove or flat surface shape.

The outer surface of the bobbin 110 may be provided with a seatinggroove 105 into which the first coil 120 is seated, fitted or disposed.The seating groove 105 may be configured to have the form of a groovedepressed from the first and second side portions 110 b-1 and 110 b-2 ofthe bobbin 110, and may have a closed curve shape (for example, a ringshape), which coincides with the shape of the first coil 120.

In order to suppress separation of the coil 120 and to guide the twoends of the coil 120 when the coil units are connected to the lowerelastic members 160-1 and 160-2, the lower surfaces of two first sideportions 110 b-1 or two second side portions 110 b-2, which arepositioned opposite the bobbin 110, may have guide grooves 116 a and 116b formed therein.

The outer surface of the bobbin 110 may be provided therein with aseating groove 180 a in which the second magnet 180 is seated, fitted,fixed or disposed.

The seating groove 180 a in the bobbin 110 may be depressed from theouter surface of the bobbin 110, and may have an opening formed in atleast one of the upper surface and the lower surface of the bobbin 110,without being limited thereto.

Furthermore, the outer surface of the bobbin 110 may be provided thereinwith a seating groove 185 a in which the third magnet 185 is seated,fitted, fixed or disposed.

The seating groove 185 a in the bobbin 110 may be depressed from theouter surface of the bobbin 110, and may have an opening, which isformed in at least one of the upper surface and the lower surface of thebobbin 110, without being limited thereto.

Each of the seating grooves 180 a and 185 a in the bobbin 110 may bepositioned above the seating groove 105 in which the first coil 120 isdisposed, and may be connected to or abut the seating groove 105,without being limited thereto. In another embodiment, the two groovesmay be spaced apart from each other.

The seating groove 180 a in the bobbin 110 may be formed in one of thefirst side portions 110 b-1 of the bobbin 110, and the seating groove185 a in the bobbin 110 may be formed in another of the first sideportions 110 b-1 of the bobbin 110.

For example, the seating grooves 180 a and 185 a may be formed in twofirst side portions of the bobbin 110 that face each other or arepositioned opposite each other.

Since the second magnet 180 and the third magnet 185 are disposed in theseating grooves 180 a and 185 a formed in two first side portions of thebobbin 110 that are positioned opposite each other, it is possible toachieve weight equilibrium between the second magnet 180 and the thirdmagnet 185, and it is possible to cause the influence on AF drivingforce due to the magnetic field interference between the first magnet130 and the second magnet 180 to cancel out the influence on AF drivingforce due to the magnetic field interference between the first magnet130 and the third magnet 185, thereby improving accuracy of AFoperation.

The bobbin 110 may be provided on the inner circumferential surfacethereof with a thread 11 for coupling to a lens or a lens barrel. Thethread 11 may be formed in the inner circumferential surface of thebobbin 110 in the state in which the bobbin 110 is held by a jig or thelike. The upper surface of the bobbin 110 may have jig-clamping grooves15 a and 15 b formed therein. For example, although the jig-clampinggrooves 15 a and 15 b may be formed in the upper surfaces of two firstside portions 110 b-1 or two second side portions 110 b-2 of the bobbin110 positioned opposite the bobbin 110, the disclosure is not limitedthereto. The jig-clamping grooves 15 a and 15 b may serve as acontaminant collector for collecting contaminants.

Next, the first coil 120 will be described.

The first coil 120 may be disposed on the outer surface of the bobbin110.

Although the first coil 120 may be disposed under the second and thirdmagnets 180 and 185, the disclosure is not limited thereto. For example,although the first coil 120 may be disposed under the projection 115 ofthe bobbin 110, the disclosure is not limited thereto.

For example, although the first coil 120 may not overlap the second andthird magnets 180 and 185 in a direction perpendicular to theoptical-axis direction, the disclosure is not limited thereto.

For example, the first coil 130 may be disposed in the seating groove105 in the bobbin 110, the second magnet 180 may be fitted or disposedin the seating groove 180 a in the bobbin 110, and the third magnet 185may be fitted or disposed in the seating groove 185 a in the bobbin 110.

Although each of the second magnet 180 and the third magnet 185 disposedat the bobbin 110 may be spaced apart from the first coil 120 in theoptical-axis direction, the disclosure is not limited thereto. Inanother embodiment, each of the second magnet 180 and the third magnet185, which are disposed at the bobbin 110, may be in contact with thefirst coil 120, or may overlap the first coil 120 in a directionperpendicular to the optical axis.

The first coil 120 may surround the outer surface of the bobbin 110about the optical axis OA in a winding direction.

Although the first coil 120 may be directly wound around the outersurface of the bobbin 110, the disclosure is not limited thereto. Inanother embodiment, the first coil 120 may be embodied as a coil ring,which is wound around the bobbin 110, or as a coil block having anangled shape.

A power or drive signal may be supplied to the coil 120.

The power or drive signal supplied to the first coil 120 may be a DCsignal, an AC signal or a signal containing both DC and AC components,and may be of a voltage type or a current type.

When a drive signal (for example, drive current) is supplied to thefirst coil 120, it is possible to create electromagnetic force resultingfrom the electromagnetic interaction with the first magnet, therebymoving the bobbin 110 in the direction of the optical axis OA by virtueof the created electromagnetic force.

At the initial position of the AF operation unit, the bobbin 110 may bemoved upwards or downwards, which is referred to as bidirectionaldriving of the AF operation unit. Alternatively, at the initial positionof the AF operation unit, the bobbin 110 may be moved upwards, which isreferred to as unidirectional driving.

At the initial position of the AF operation unit, the first coil 120 maybe disposed so as to correspond to the first magnet 130 disposed at thehousing 140 in a direction parallel to a line which is perpendicular tothe optical axis OA and extends through the optical axis.

For example, the AF operation unit may include the bobbin 110 and thecomponents (for example, the first coil 120 and the second and thirdmagnets 180 and 185) coupled to the bobbin 110.

The initial position of the AF operation unit may be the originalposition of the AF operation unit in the state in which no electricpower is applied to the first coil 1120 or the position at which the AFoperation unit is located as the result of the upper and lower elasticmembers 150 and 160 being elastically deformed due only to the weight ofthe AF operation unit.

In addition, the initial position of the bobbin 110 may be the positionat which the AF operation unit is located when gravity acts in thedirection from the bobbin 110 to the base 210 or when gravity acts inthe direction from the base 210 to the bobbin 110.

Next, the second magnet 180 and the third magnet 185 will be described.

The second magnet 180 may be referred to as a sensing magnet because thesecond magnet 180 provides a magnetic field, which is detected by thefirst position sensor 170, and the third magnet 185 may be referred toas a balancing magnet, which cancels out the influence of the magneticfield of the sensing magnet 180 and establishes weight equilibrium withrespect to the sensing magnet 180.

The second magnet 180 may be disposed in the seating groove 180 a in thebobbin 110 so as to face the first position sensor 170.

Although the second magnet 180, which faces the first position sensor170, may be exposed at a portion of one surface thereof from the seatinggroove 180 a, the disclosure is not limited thereto. In anotherembodiment, the second magnet 180, which faces the first position sensor170, may not be exposed at a portion of one surface thereof from theseating groove 180 a.

For example, each of the second and third magnets 180 and 185 disposedat the bobbin 110 may be configured such that the interface between theN pole and the S pole is parallel to a direction perpendicular to theoptical axis OA. For example, although each of the surfaces of thesecond and third magnets 180 and 185 that face the first position sensor170 may be divided into the N pole and the S pole, the disclosure is notlimited thereto.

In another embodiment, for example, the interface between the N pole andthe S pole of each of the second and third magnets 180 and 185 disposedat the bobbin 110 may be parallel to the optical axis OA.

Although each of the second and third magnets 180 and 185 may be amonopolar magnetized magnet having one N pole and one S pole, thedisclosure is not limited thereto. In another embodiment, each of thesecond and third magnets 180 and 185 may be a bipolar magnetized magnet,which has two N poles and two S poles, or a tetrapolar magnetizedmagnet.

Each of the second and third magnets 180 and 185 may include a firstmagnet part 17 a, a second magnet part 17 b and a partition wall 17 cdisposed between the first magnet part 17 a and the second magnet part17 b. Here, the partition wall 17 c may also be alternatively referredto as “nonmagnetic partition wall”.

The first magnet part 17 a may include an N pole, an S pole and a firstinterface portion between the N pole and the S pole. The first interfaceportion may be a portion that has substantially no magnetism and has azone having almost no polarity, and may be a portion which is naturallyformed in order to form a magnet composed of one N pole and one S pole.

The second magnet part 17 b may include an N pole, an S pole and asecond interface surface between the N pole and the S pole. The secondinterface portion may be a portion that has substantially no magnetismand has a zone having almost no polarity, and may be a portion that isnaturally formed in order to form a magnet composed of one N pole andone S pole.

The partition wall 17 c may separate or isolate the first magnet part 17a and the second magnet part 17 b from each other, and may be a portionhaving substantially no magnetism or polarity. For example, thepartition wall may be a nonmagnetic material, air or the like. Thenonmagnetic partition wall may be considered a “neutral zone” or a“neutral portion”.

The partition wall 17 c may be a portion that is artificially formedwhen the first magnet part 17 a and the second magnet part 17 b aremagnetized, and the width of the partition wall 17 c may be larger thanthe width of the first interface portion (or the width of the secondinterface portion). Here, the width of the partition wall 17 c may bethe length of the partition wall 17 c in a direction toward the secondmagnet part 17 b from the first magnet part 17 a. The width of the firstinterface portion (or the second interface portion) may be the length ofeach of the first and second magnet parts 17 a and 17 b toward the Spole from the N pole.

The second magnet 180 may be moved together with the bobbin 110 in theoptical-axis direction, and the first position sensor 170 may detect theintensity or magnetic force of the magnetic field of the second magnet180, which is moved in the optical-axis direction, and may output anoutput signal corresponding to the result of the detection.

For example, in accordance with displacement of the bobbin 110 in theoptical-axis direction, the intensity or magnetic force of the magneticfield detected by the first position sensor 170 may vary. Consequently,the first position sensor 170 may output an output signal proportionalto the detected intensity of the magnetic field, and the displacement ofthe bobbin 110 in the optical-axis direction may be detected using theoutput signal from the first position sensor 170.

Next, the housing 140 will be described.

The housing 140 accommodates therein the bobbin 110, and supports thefirst magnet 130, the first position sensor 170, and the circuit board190.

FIG. 4A is a perspective view of the housing 140, the circuit board 190,the position sensor 170, and the capacitor 195, which are shown inFIG. 1. FIG. 4B is an assembled perspective view of the housing 140, thefirst magnet 130, the circuit board 190, the first position sensor 170,and the capacitor 195.

Referring to FIGS. 4A and 4B, the housing 140 may be configured to havea hollow column overall. For example, the housing 140 may have apolygonal (for example, a rectangular or octagonal) or circular bore,and the bore in the housing 140 may be a through hole, which is formedthrough the housing 140 in the optical-axis direction.

The housing 140 may include a plurality of side portions 141-1 to 141-4and a plurality of corner portions 142-1 to 142-4.

For example, the housing may include first to fourth side portions 141-1to 141-4, which are spaced apart from each other, and first to fourthcorner portions 142-1 to 142-4, which are spaced apart from each other.

Each of the corner portions 142-1 to 142-4 of the housing 140 may bedisposed or positioned between two adjacent side portions 141-1 and141-2, 141-2 and 141-3, 141-3 and 141-4, and 141-4 and 141-1 so as toconnect the side portions to each other.

For example, the corner portions 142-1 to 142-4 may be positioned at thecorners of the housing 140. For example, although the number of sideportions of the housing 140 is four and the number of corner portions isfour, the disclosure is not limited thereto. The number of side portionsor corner portions may be five or more.

Each of the side portions 141-1 to 141-4 of the housing 140 may bedisposed parallel to a corresponding one of side plates of the covermember 300.

For example, the side portions 141-1 to 141-4 of the housing 140 mayrespectively correspond to the first side portions 110 b-1 of the bobbin110, and the corner portions 142-1 to 142-4 of the housing 140 mayrespectively correspond to or face the second side portions 110 b-2 ofthe bobbin 110.

The first magnet 130 may be disposed or mounted on the corner portions142-1 to 142-4 of the housing 140.

For example, each of the corners or the corner portions 142-1 to 142-4of the housing 140 may be provided with a seating portion or a receptionportion 141 a for receiving the magnet 130 therein.

The seating portion 141 a of the housing 140 may be formed in the lowerportion or the lower end of at least one of the corner portions 142-1 to142-4 of the housing 140.

For example, the seating portion 141 a in the housing 140 may be formedin an inner portion of the lower portion or the lower end of each of thefour corner portions 142-1 to 142-4.

Although each of the seating portion 141 a in the housing 140 may have agroove, for example, a recessed groove having a shape corresponding tothe first magnet 130, the disclosure is not limited thereto.

For example, a first opening may be formed in a side surface of theseating portion 141 a in the housing 140, which faces the first coil120, and a second opening may be formed in the lower surface of theseating portion 141 a in the housing 140, which faces the second coil230, in order to facilitate mounting of the first magnet 130.

For example, a first surface 11 a of the first magnet 130, which isfixed to or disposed in the seating portion 141 a in the housing 140,may be exposed through the first opening in the seating portion 141 a.Furthermore, a lower surface 11 c of the first magnet 130, which isfixed to or disposed in the seating portion 141 a in the housing 140,may be exposed through the second opening in the seating portion 141 a.

The housing 140 may have an escape groove 41 formed in the upper surfaceof each of the corner portions in order to avoid spatial interferencewith the first frame connector 153 of the upper elastic member 150.

For example, the escape groove 41 in the housing 140 may be depressedfrom the upper surface of the housing 140, and may be positioned closerto the center of the housing 140 than is a stopper 145 or an adhesiveinjection hole 147. For example, the escape groove 41 may be positionedfurther inwards than the stopper 145 of the housing 140 in a directiontoward the center of the housing 140, and the adhesive injection holes146 a and 146 b may be positioned opposite the escape groove 41 withrespect to the stopper 145.

Each of the corner portions 142-1 to 142-4 of the housing 140 may havetherein the groove 25 a, which corresponds to or faces the projection115 of the bobbin 110. The groove 25 a in the housing 140 may bepositioned at the seating portion 141 a in the housing 140. For example,the groove 25 a in the housing 140 may be formed in the bottom surfaceof the escape groove 41. For example, the bottom surface of the groove25 a may be positioned lower than the bottom surface of the escapegroove 41, and the seating groove 141 a in the housing 140 may bepositioned lower than the bottom surface of the escape groove 41.

Although the first magnet 130 may be fixed to the seating portion 141 aby means of an adhesive, the disclosure is not limited thereto.

For example, each of the corner portions 142-1 to 142-4 of the housing140 may be provided with one or more adhesive injection holes 146 a and146 b through which an adhesive is injected. The one or more adhesiveinjection holes 146 a and 146 b may be depressed from the upper surfaceof corresponding corner portions 142-1 to 142-4.

Each of the adhesive injection holes 146 a and 146 b may have a throughhole, which is formed through a corresponding one of the corner portions142-1 to 142-4, may be connected to or communicate with the seatinggroove 141 a in the housing 140, and may expose at least a portion ofthe first magnet 130 (for example, at least a portion of the uppersurface of the magnet 130). Since each of the adhesive injection holes146 a and 146 b exposes at least a portion of the first magnet 140 (forexample, at least a portion of the upper surface of the magnet 130), itis possible to efficiently apply an adhesive to the first magnet 130 andthus to increase the coupling force between the first magnet 130 and thehousing 140.

The housing 140 may include at least one stopper 147 a projecting fromthe outer surfaces of the side portions 141-1 to 141-4, and the at leastone stopper 147 a may serve to inhibit the housing 140 from collidingwith the side plate of the cover member 300 when the housing 140 movesin a direction perpendicular to the optical axis.

In order to inhibit the lower surface of the housing 140 from collidingwith the base 210 and/or the circuit board 250, the housing 140 mayinclude a stopper (not shown) projecting from the lower surface thereof

The housing 140 have a mounting groove 14 a (or a seating groove)configured to receive the circuit board 190, a mounting groove 14 b (ora seating groove) configured to receive the position sensor 170, and amounting groove 14 c (or a seating groove) configured to receive thecapacitor 195.

The mounting groove 14 a in the housing 140 may be formed in the upperportion or the upper end of one of the side portions 141-1 to 141-4 ofthe housing 140 (for example, 141-1).

In order to facilitate mounting of the circuit board 190, the mountinggroove 14 a in the housing 140 may have a groove structure, which isopen at the upper surface thereof and has a side surface and a bottomsurface and an opening formed in the inner surface thereof so as to beexposed to the inside of the housing 140. The mounting groove 14 a inthe housing 140 may have a shape that corresponds to or coincides withthe shape of the circuit board 190.

The mounting groove 14 b in the housing 140 may be formed in the innersurface of the first side portion 141-1 of the housing 140, and may beconnected to the mounting groove 14 a.

A mounting groove 14 c in the housing 140 may be formed at a portion ofthe mounting groove 14 b, and a protrusion or a projection may beprovided between the mounting groove 14 b and the mounting groove 14 cso as to separate or isolate the capacitor 195 from the first positionsensor 170. The reason for this is to position the capacitor 195 and theposition sensor 170 close to each other and to reduce the length of thepath for electrical connection between the capacitor 195 and theposition sensor 170 in order to reduce noise caused by a long path.

The capacitor 195 may be disposed or mounted on a second surface 19 a ofthe circuit board 190.

The capacitor 195 may be configured to have a chip shape. Here, the chipmay include a first terminal, which corresponds to one end of thecapacitor 195, and a second terminal, which corresponds to the other endof the capacitor 195. The capacitor 195 may be alternatively referred toas a “capacitive element” or “condenser”.

In another embodiment, the capacitor may be embodied as being includedin the circuit board 190. For example, the circuit board 190 may includethe capacitor including a first conductive layer, a second conductivelayer, and an insulation layer (for example, a dielectric layer)disposed between the first and second conductive layers.

The capacitor 195 may be conductively connected in parallel to first andsecond terminals B1 and B2 of the circuit board 190 through which power(or a drive signal) is supplied to the position sensor 170 from theoutside.

Alternatively, the capacitor 195 may be conductively connected inparallel to the terminals of the first position sensor 170, which isconductively connected to the first and second terminals B1 and B2 ofthe circuit board 190.

For example, one end of the capacitor 195 (or the first terminal of thecapacitor chip) may be conductively connected to the first terminal B1of the circuit board 190, and the other end of the capacitor 195 (or thefirst terminal of the capacitor chip) may be conductively connected tothe second terminal B2 of the circuit board 190.

Since the capacitor 195 is conductively connected in parallel to thefirst and second terminals B1 and B2 of the circuit board 190, thecapacitor 195 is capable of serving as a smoothing circuit foreliminating ripple components included in the power signals GND and VDD,which are supplied to the first position sensor 170 from the outside,and is thus capable of supplying stable and consistent power signals tothe first position sensor 170.

Furthermore, since the capacitor 195 is conductively connected inparallel to the first and second terminals B1 and B2 of the circuitboard 190, it is possible to protect the first position sensor 170 fromhigh-frequency noise, ESD and the like, which is introduced from theoutside.

In addition, the capacitor 195 is capable of inhibiting overcurrent,which is caused by high-frequency noise, ESD or the like introduced fromthe outside, from being applied to the first position sensor 170, and iscapable of inhibiting a calibration value for displacement of the bobbin110, which is obtained based on the signal output from the firstposition sensor 170, from being reset due to the overcurrent.

The mounting groove 14 b of the housing 140 may be open at the upperportion thereof in order to facilitate mounting of the first positionsensor 170, and may have an opening, which is formed in the innersurface of the first side portion 141-1 of the housing 140 in order toimprove the sensitivity of the position sensor 170. The mounting groove14 b in the housing 140 may have a shape corresponding to or coincidingwith the shape of the position sensor 170.

For example, the circuit board 190 may be secured in the mounting groove14 a in the housing 140 using an adhesive member. Although the adhesivemember may be epoxy or double-sided adhesive tape, the disclosure is notlimited thereto.

The corner portions 142-1 to 142-4 of the housing 140 may berespectively provided therein with the support members 220-1 to 220-4.

The corner portions 142-1 to 142-4 of the housing 140 may berespectively provided therein with holes 147, which define paths throughwhich the support members 220-1 to 220-4 extend. For example, thehousing 140 may include the holes 147, which are respectively formedthrough the upper portions of the corner portions 142-1 to 142-4 of thehousing 140.

In another embodiment, each of the holes formed in the corner portions142-1 to 142-4 of the housing 140 may be depressed from the outersurface of the corner portion, and at least a portion of the hole may beopen at the outer surface of the corner portion. The number of holes 147in the housing 140 may be the same as the number of support members.

One end of each of the support members 220 may be connected or bonded tothe upper elastic member 150 through the hole 147.

For example, although the diameter of the hole 147 may graduallyincrease in a direction toward the lower surface from the upper surfaceof the housing 140 in order to allow a damper to be easily applied, thedisclosure is not limited thereto. In another embodiment, the diameterof the hole 147 may be constant.

In order not only to define the paths through which the support members220-1 to 220-4 extend but also to avoid spatial interference between thesupport members 220-1 to 220-4 and the corner portions 142-1 to 142-4 ofthe housing 140, escape grooves 148 a may be respectively formed in theouter surfaces 148 of the corner portions 142-1 to 142-4. Although eachof the escape grooves 148 a may be connected to the hole 147 in thehousing 140 and may have a semicircular or semi-elliptical section, thedisclosure is not limited thereto. The lower portion or the lower end ofthe escape groove 148 a may be connected to the lower surface of thehousing 140.

For example, although the diameter of the escape groove 148 a maygradually decrease downwards, the disclosure is not limited thereto.

In order to inhibit the housing 140 from directly colliding with theinner surface of the upper plate of the cover member 300, the housing140 may be provided at the upper portion, the upper end or the uppersurface thereof with the stoppers 145.

For example, although the stoppers 145 may respectively be disposed onthe upper surfaces of the corner portions 142-1 to 142-4 of the housing140, the disclosure is not limited thereto.

In order to inhibit the lower surface of the housing 140 from collidingwith the base 210 and/or the circuit board 250, the housing 140 mayfurther be provided at the lower portion, the lower end or the lowersurface thereof with stoppers (not shown).

Furthermore, the corners of the upper surfaces of the corner portions142-1 to 142-4 of the housing 140 may be respectively provided withguide projections 144 in order to inhibit the damper from overflowing.

For example, each of the holes 147 in the housing 140 may be positionedbetween the corner (for example, the guide projection 144) and thestopper 145 on the upper surface of a corresponding one of the cornerportions 142-1 to 142-4 of the housing 140.

The upper portion, the upper end or the upper surface of the housing 140may be provided with at least one coupler 143, which is coupled to thefirst outer frame 152 of the upper elastic member 150.

The first coupler 143 of the housing 140 may be disposed at at least oneof the side portions 141-1 to 141-4 and the corner portions 142-1 to142-4 of the housing 140.

The lower portion, the lower end or the lower surface of the housing 140may be provided with a second coupler 149, which is coupled or securedto the second outer frame 162 of the lower elastic member 160.

Although each of the first and second couplers 143 and 149 of thehousing 140 may have a protrusion shape, the disclosure is not limitedthereto. In another embodiment, the coupler may have a groove or flatsurface shape.

For example, the first coupler 143 of the housing 140 may be coupled tothe hole 152 a in the first outer frame 152 of the upper elastic member150 using an adhesive member (for example, solder) or heat fusion, andthe second coupler 149 of the housing 140 may be coupled to the hole 162a in the second outer frame 162 of the lower elastic member 160 using anadhesive member (for example, solder) or heat fusion.

In order to avoid spatial interference with the portions at which thesecond outer frames 162-1 to 162-3 of the lower elastic member 160 meetsecond frame connectors 163, an escape groove 44 a may be formed in thelower surface of at least one of the side portions 141-1 of the housing140.

Next, the first magnet 130 will be described.

The first magnet 130 may be disposed at at least one of the corners (orthe corner portions 142-1 to 142-4) of the housing 140. For example, thefirst magnet 130 may be disposed at the corners of the housing 140.

At the initial position of the AF operation unit, each of the firstmagnets 130: 130-1 to 130-4 may be disposed at the housing 140 such thatat least a portion thereof overlaps the first coil 120 in a directionparallel to a line that is perpendicular to the optical axis OA andextends through the optical axis OA.

For example, each of the first magnets 130: 130-1 to 130-4 may be fittedor disposed in the seating portion 141 a in a corresponding one of thecorner portions 141-1 to 141-4 of the housing 140.

In another embodiment, the first magnet 130 may be disposed on the outersurfaces of the corner portions 141-1 to 141-4 of the housing 140.

The magnets 130 may have a polyhedral shape, which is easily seated onthe corner portions of the housing 140.

For example, the surface area of the first surface of the first magnet130 may be greater than the surface area of the second surface thereof.The first surface of the first magnet 130 may a surface that faces onesurface of the first coil 120 (or the outer surface of the bobbin 110),and the second surface of the first magnet 130 may be a surface oppositethe first surface.

For example, the crosswise length of the second surface of the firstmagnet 130 may be less than the crosswise length of the first surface.

For example, the first magnet 130 may include a portion in which thecrosswise length thereof decreases in a direction toward the secondsurface from the first surface of the first magnet 130. For example, thecrosswise direction of the first magnet 130 may be a direction parallelto the first surface of the first magnet 130.

Each of the first magnets 130-1 to 130-4 may be integrally formed, andeach of the first magnets 130-1 to 130-4, which face the first coil 120,may be provided on the first surface thereof with an S pole and on thesecond surface thereof with an N pole. However, the disclosure is notlimited thereto, and each of the first magnets 130-1 to 130-4 may beprovided on the first surface thereof with an N pole and on the secondsurface thereof with an S pole in another embodiment.

The first magnets may include at least two magnets, which are disposedor mounted on the corner portions of the housing 140 so as to face eachother.

For example, two pairs of first magnets, which are disposed such thatthe first magnets in each pair face each other, may be disposed at thecorner portions 142-1 to 142-4 of the housing 140. Here, the horizontalsurface of each of the magnets 130-1 to 130-4 may have a polygonalshape, such as a triangular, pentagonal, hexagonal or rhombus shape.

In another embodiment, one pair of first magnets, which face each other,may be disposed at only two of the corner portions of the housing 140,which face each other.

Although each of the first magnets 130-1 to 130-4 may be a monopolarmagnetized magnet, the disclosure is not limited thereto. In anotherembodiment, each of the first magnets 130-1 to 130-4 may be a bipolarmagnetized magnet, which has two N poles and two S poles, or atetrapolar magnetized magnet.

FIG. 5 is a cross-sectional view of the lens moving apparatus 100 shownin FIG. 2 taken along line A-B. FIG. 6 is a cross-sectional view of thelens moving apparatus 100 shown in FIG. 2 taken along line C-D. FIG. 7is a cross-sectional view of the lens moving apparatus 100 shown in FIG.2 taken along line E-F.

Referring to FIGS. 5 to 7, although each of the second and third magnets180 and 185 may not overlap the first coil 120 in a directionperpendicular to the optical axis OA or in a direction parallel to aline that is perpendicular to the optical axis OA and extends throughthe optical axis, the disclosure is not limited thereto. In anotherembodiment, each of the second and third magnets 180 and 185 may overlapthe first coil 120.

At the initial position of the AF operation unit, the first magnet 130may overlap the first coil 120 in a direction perpendicular to theoptical axis OA or in a direction parallel to a line that isperpendicular to the optical axis and extends through the optical axis.

At the initial position of the AF operation unit, although the secondmagnet 180 may overlap or be aligned with the third magnet 185 in adirection perpendicular to the optical axis OA, or in a directionparallel to a line that is perpendicular to the optical axis and extendsthrough the optical axis, the disclosure is not limited thereto.

At the initial position of the AF operation unit, although the firstposition sensor 170 may overlap at least one of the second magnet 180and the third magnet 185 in a direction perpendicular to the opticalaxis OA, or in a direction parallel to a line which is perpendicular tothe optical axis and extends through the optical axis.

In another embodiment, the first position sensor 170 may not overlap atleast one of the second and third magnets 180 and 185 in a directionperpendicular to the optical axis OA, or in a direction parallel to aline that is perpendicular to the optical axis and extends through theoptical axis.

Next, the circuit board 190 and the first position sensor 170 will bedescribed.

The circuit board 190 may be disposed at one side portion 141-1 of thehousing 140, and the first position sensor 170 may be disposed ormounted on the circuit board 190. For example, the circuit board 190 maybe disposed in the first mounting groove 14 a in the housing 140.

For example, the circuit board 190 may be disposed between the firstcorner portion 142-1 and the second corner portion 142-2 of the housing140, and first to fourth terminals B1 to B4 of the circuit board 190 maybe conductively connected to the first position sensor 170.

For example, the circuit board 190 may not overlap an imaginary line,which connects the corner portion (for example, the first corner portion142-1) or the corner of the housing 140 to the optical axis OA. Thereason for this is to inhibit spatial interference between the supportmember 220 and the circuit board 190.

FIG. 8A is an enlarged view of the circuit board 190 and the firstposition sensor 170. FIG. 8B is a schematic view of an embodiment of thefirst sensor 170 shown in FIG. 8A.

Referring to FIGS. 8A and 8B, the circuit board 190 may includeterminals B1 to B6, which are to be conductively connected to externalterminals or external devices.

The first position sensor 170 may be disposed on the first surface 19 bof the circuit board 190, and the terminals B1 to B6 may be disposed onthe second surface 19 a of the circuit board 190.

Here, the second surface 19 a of the circuit board 190 may be thesurface opposite the first surface 19 b of the circuit board 190. Forexample, the second surface 19 a of the circuit board 190 may be thesurface of the circuit board 190 that faces the bobbin 110.

The circuit board 190 may include a body part S1 and an extension partS2, positioned under the body part S1. The body part S1 may bealternatively referred to as an “upper part”, and the extension part S2may be alternatively referred to as a “lower part”.

The extension part S2 may extend downwards from the body part S1.

The body part S1 may have a form projecting from side surfaces 16 a and16 b of the extension part S2. For example, the side surfaces 16 a and16 b of the extension part S2 may be surfaces connecting the firstsurface 19 b to the second surface 19 a of the extension part S2.

The body part S1 may include a first extension region A1 extending in adirection toward the first corner portion 142-1 and a second extensionregion A2 extending in a direction toward the second corner portion142-2 of the housing 140.

For example, the first extension region A1 may extend or project fromthe first side surface 16 a of the extension part S2, and the secondextension region A2 may extend or project from the second side surface16B of the extension part S2.

For example, although the crosswise length of the first extension regionA1 is shown as being greater than the crosswise length of the secondextension region A2 in FIG. 8A, the disclosure is not limited thereto.In another embodiment, the crosswise length of the first extensionregion A1 may be equal to or less than the crosswise length of thesecond extension region A2.

For example, the crosswise length of the body part S1 of the circuitboard 190 may be greater than the crosswise length of the extension partS2.

For example, the first to fourth terminals B1 to B4 of the circuit board190 may be disposed on the first surface 19 b so as to be spaced apartfrom one another. For example, the four terminals B1 to B4 may bearranged in the crosswise direction of the circuit board 190 in a line.

The first to fourth terminals B1 to B4 may be disposed closer to theupper surface 19 c than to the lower surface of the circuit board 190.

For example, the first to fourth terminals B1 to B4 may be formed so asto abut on both the second surface 19 a of the circuit board 190 and theupper surface 19 c of the body part S1 of the circuit board 190 abuttingon the second surface 19 a.

For example, at least one of the first to fourth terminals B1 to B4 mayinclude a groove or a via 7 a formed in the upper surface 19 c of thecircuit board 190. By virtue of the groove 7 a, the contact area betweensolder and the terminals B3 and B4 is increased, thereby improvingadhesive force and solderability.

The fifth terminal B5 and the sixth terminal B6 of the circuit board 180may be disposed on the first surface 19 b of the extension part S2 ofthe circuit board 190 so as to be spaced apart from each other.

The circuit board 190 may have a groove or hole 8 a formed between thefifth terminal B5 and the sixth terminal B6. The groove 8 a may bedepressed from the lower surface of the circuit board 190, and may beopen both at the first surface 19 b and at the second surface 19 a ofthe circuit board 190.

Since solder is not applied to the portion between the fifth terminal B5and the sixth terminal B6 by virtue of the groove 8 a during solderingfor conductive connection to external components, it is possible toinhibit an electrical short between the fifth terminal B5 and the sixthterminal B6.

For example, at least one of the fifth and sixth terminals B5 and B6 mayinclude a groove or a via 7 b formed in the lower surface of the circuitboard 190. By virtue of the groove 7 b, the size of the contact areabetween the solder and the fifth and sixth terminals B5 and B6 isincreased, thereby improving adhesive force and solderability.

The circuit board 190 may include a groove 90 a formed between thesecond terminal B2 and the third terminal B3 and a groove 90 b formedbetween the first terminal B1 and the fourth terminal B4. Here, thegrooves 90 a and 90 b may be alternatively referred to as “escapegrooves”.

Each of the first groove 90 a and the second groove 90 b may bedepressed from the upper surface 19 c of the circuit board 190, and maybe open both at the first surface 19 b and at the second surface 19 a ofthe circuit board 190.

The first groove 90 a in the circuit board 190 may be formed in order toavoid spatial interference with a first outer frame 151 of a third upperelastic unit 150-3, and the second groove 90 b in the circuit board 190may be formed in order to avoid spatial interference with a first outerframe 151 of a fourth upper elastic unit 150-4.

For example, the circuit board 190 may be embodied as a printed circuitboard or an FPCB.

The circuit board 190 may include a circuit pattern or a wire (notshown) for conductively connecting the first to sixth terminals B1 to B6to the first position sensor 170.

The first position sensor 170 may detect the magnetic field or theintensity of the magnetic field of the second sensing magnet 180 mountedon the bobbin 110 during movement of the bobbin 110, and may output anoutput signal corresponding to the result of the detection.

The first position sensor 170 may be mounted on the circuit board 190disposed at the housing 140, and may be secured to the housing 140. Forexample, the first position sensor 170 may be disposed in the mountinggroove 14 b in the housing 190, and may be moved together with thehousing 140 during handshake correction.

The first position sensor 170 may be disposed on the second surface 19 aof the circuit board 190. In another embodiment, the first positionsensor 170 may be disposed on the first surface 19 b of the circuitboard 190.

The first position sensor 170 may include a Hall sensor 61A and a driver62A.

For example, the hall sensor 61A may be made of silicone, and the outputVH1 of the hall sensor 61A may increase as the ambient temperatureincreases. For example, the ambient temperature may be the temperatureof the lens moving apparatus, for example, a temperature of the circuitboard 190, the temperature of the hall sensor 61A or the temperature ofthe driver 62A.

In another embodiment, the hall sensor 61A may be made of GaAs, and theoutput VH of the hall sensor 61A may decrease as the ambient temperatureincreases. In another embodiment, the output of the hall sensor 61A mayhave a slope of about −0.06%/° C. with respect to an ambienttemperature.

The first position sensor 170 may further include a temperature-sensingelement 63A capable of detecting an ambient temperature. Thetemperature-sensing element 63A may output a temperature detectionsignal Ts1, corresponding to the result of detection of the ambienttemperature of the first position sensor 170A, to the driver 62A.

For example, the hall sensor 61 of the first position sensor 190 maygenerate the output VH corresponding to the result of detection of theintensity of the magnetic force of the second magnet 180. For example,the intensity of the output of the first position sensor 190 may beproportional to the intensity of the detected magnetic force of thesecond magnet 180.

The driver 62A may output a drive signal dV1 for driving the hall sensor61A and a drive signal Id1 for driving the first coil 120.

For example, the driver 62A may receive a clock signal SCL, a datasignal SDA and power signals VDD and GND from the controller 830 or 780through data communication using a protocol such as I2C communication.

Here, although the first power signal GND may be a ground voltage or OVand the second power signal VDD may be a predetermined voltage fordriving the driver 62, and may be DC voltage and/or AC voltage, thedisclosure is not limited thereto.

Furthermore, the driver 62A may receive the output VH1 of the hallsensor 61A, and may send the clock signal SCL and the data signal SDApertaining to the output VH1 of the hall sensor 61A to the controller830 or 780 through data communication using a protocol such as I2Ccommunication.

Furthermore, the driver 62A may receive the temperature detection signalTs1 as a result of detection by the temperature-sensing element 63A, andmay send the temperature detection signal Ts1 to controller 830 or 780through the data communication using a protocol such as the I2Ccommunication.

For example, the driver 62A may further include an amplifier, whichreceives the output VH1 of the Hall sensor 61A and amplifies and outputsthe received output VH1 of the Hall sensor 61A in response to a controlsignal. For example, the amplifier may be a variable gain amplifier, inwhich a gain is variable in response to the control signal.

For example, the driver 62A may further include an analog-digitalconverter, which performs analog-to-digital conversion for the output ofthe amplifier and outputs the converted digital signal.

The driver 62A may further include an interface unit capable ofperforming data communication, for example, I2C communication using anexternal host and a protocol and capable of transmitting and receiving aclock signal SCL and a data signal SDA.

The driver 62A may further include a memory, for example, an EEPROM inwhich an initial register setting value of the first position sensor 170for displacement of the operation unit (for example, the bobbin 110) anda calculated value are stored.

The driver 62A may further include a logical controller, configured tocreate a control signal to control the gain of the amplifier.

The driver 62A may further include a PID controller (aproportional-integral-derivative controller) configured to perform phasecompensation and/or gain compensation for the output of theanalog-digital converter. The logical controller may control the phasecompensation and/or the gain compensation of the PID controller.

The driver 62A may further include a drive-signal creator for creating adrive signal Id1 based on the output of the PID controller.

The controller 830 or 780 may perform temperature compensation for theoutput VH1 from the hall sensor 61A based on variation in the ambienttemperature detected by the temperature-sensing element 63A of the firstposition sensor 170.

The first position sensor 170 may include the first to fourth terminalsN1 to N4 for the power signals VDD and GND, the clock signal SCL and thedata SDA, and the fifth and sixth terminals N5 and N6 for providingdrive signals Id1 to the first coil 120.

Each of the first to fourth terminals N1 to N4 of the first positionsensor 170 may be conductively connected to a corresponding one of thefirst to fourth terminals B1 to B4 of the circuit board 190, and each ofthe fifth and sixth terminals N5 and N6 of the first position sensor 170may be conductively connected to a corresponding one of the fifth andsixth terminals B5 and B6 of the circuit board 190.

Each of the first to sixth terminals B1 to B6 of the circuit board 190may be conductively connected to a corresponding one of the terminals21-1 to 21-n of the circuit board 250 through the upper elastic member150 (and/or the lower elastic member 160) and the support member 220.

For example, the first to fourth terminals B1 to B4 of the circuit board190 may be conductively connected to the upper elastic units 150-1 to150-4 and the support members 220-1 to 220-4, whereby each of the firstto fourth terminals B1 to B4 of the first position sensor 170 may beconductively connected to a corresponding one of the terminals 21-1 to21-n (n=4) of the circuit board 250.

For example, the fifth and sixth terminals B5 and B6 of the circuitboard 190 may be conductively connected to the lower elastic units 160-1and 160-2, and the fifth and sixth terminals B5 and B6 of the firstposition sensor 170 may be conductively connected to the first coil 120via the lower elastic units 160-1 and 160-2.

For example, the fifth terminal B5 of the circuit board 190 may becoupled to the first lower elastic unit 160-1, and the sixth terminal B6of the circuit board 190 may be coupled to the second lower elastic unit160-2.

Next, the upper elastic member 150, the lower elastic member 160 and thesupport member 220 will be described.

FIG. 9A is a view illustrating the upper elastic member 150 shown inFIG. 1. FIG. 9B is a view illustrating the lower elastic member 160shown in FIG. 1. FIG. 10 is an assembled perspective view of the upperelastic member 150, the lower elastic member 160, the base 210, thesupport member 220, the second coil 230, the circuit board 250 and thesecond position sensor 240. FIG. 11A is a view illustrating the couplingrelationship between the first to fourth terminals B1 to B4 of thecircuit board 190 and the upper elastic units 150-1 to 150-4. FIG. 11Bis a bottom view of the fifth and sixth terminals B5 and B6 of thecircuit board 190 and the lower elastic units 160-1 and 160-2. FIG. 12Ais an exploded perspective view of the second coil 230, the circuitboard 250, the base 210, and the second position sensor 240. FIG. 12B isan assembled perspective view of the second coil 230, the circuit board250, the base 210, and the second position sensor 240. FIG. 13 is a planview of the base 210, the circuit board 250, and the first and secondsensors 240 a and 240 b. FIG. 14 is a plan view of the base 210, thecircuit board 250, the first and second sensors 240 a and 240 b, and thesecond coil 230. FIG. 15 is a cross-sectional view of the componentsshown in FIG. 15, taken along line G-H.

Referring to FIGS. 9A to 15, the upper elastic member 150 and the lowerelastic member 160 may be coupled both to the bobbin 110 and to thehousing 140 so as to support the bobbin 110.

The upper elastic member 150 may be coupled to the upper portion, theupper end or the upper surface of the bobbin 110, and the lower elasticmember 160 may be coupled to the lower portion, the lower end or thelower surface of the bobbin 110.

The upper elastic member 150 and the lower elastic member 160 mayelastically support the bobbin 110 with respect to the housing 140.

The support member 220 may support the housing 140 so as to allow thehousing 140 to be moved in a direction perpendicular to the opticalaxis, and may conductively connect at least one of the upper and lowerelastic members 150 and 160 to the circuit board 250.

Referring to FIG. 9A, the upper elastic member 150 may include aplurality of upper elastic units 150-1 to 150-4, which are conductivelyisolated from each other. Although FIG. 9A illustrates four upperelastic units, which are conductively isolated from each other, thenumber of upper elastic units is not limited thereto, and may be threeor more.

The upper elastic member 150 may include the first to fourth upperelastic units 150-1 to 150-4, which are directly bonded and thusconductively connected to the first to fourth terminals B1 to B4 of thecircuit board 190.

A portion of each of the plurality of upper elastic units may bedisposed at the first side portion 141-1 of the housing 140, at whichthe circuit board 190 is disposed, and at least one upper elastic unitmay be disposed at each of the remaining second to fourth side portions141-2 to 141-4, other than the first side portion 141-1 of the housing140.

Each of the first to fourth upper elastic units 150-1 to 150-4 mayinclude the first outer frame 152 coupled to the housing 140.

At least one of the first to fourth upper elastic units 150-1 to 150-4may further include the first inner frame 151, coupled to the bobbin110, and the first frame connector 153, connecting the first inner frame151 to the first outer frame 152.

In the embodiment shown in FIG. 9A, each of the first and second upperelastic units 150-1 and 150-2 may include only the first outer frame,without including the first inner frame and the first frame connector,and each of the first and second upper elastic units 150-1 and 150-2 maybe spaced apart from the bobbin 110.

Although each of the third and fourth upper elastic units 150-3 and150-4 may include the first inner frame 151, the first outer frame, andthe first frame connector 153, the disclosure is not limited thereto.

For example, although each of the first inner frames 151 of the thirdand fourth upper elastic units 150-3 and 150-4 may be provided with ahole 151 a coupled to the first coupler 113 of the bobbin 110, thedisclosure is not limited thereto. For example, the hole 152 a in thefirst inner frame 151 may have at least one slit 51 a, through which anadhesive member enters, between the first coupler 113 and the hole 151a.

Each of the first outer frames 152 of the first to fourth upper elasticmembers 150-1 to 150-4 may have therein a hole 152 a coupled to thefirst coupler 143 of the housing 140.

The first outer frame 151 of each of the first to fourth upper elasticunits 150-1 to 150-4 may include a body portion coupled to the housing140, and connecting terminals P1 to P4, which are connected to acorresponding one of the first to fourth terminals B1 to B4 of thecircuit board 190. Here, the connecting terminals P1 to P4 may bealternatively referred to as “extension portions”.

The first outer frame 151 of each of the first to fourth upper elasticunits 150-1 to 150-4 may include a first coupler 520 coupled to thehousing 140, a second coupler 510 coupled to a corresponding one of thesupport members 220-1 to 220-4, a connector 530 connecting the firstcoupler 520 to the second coupler 510, and the extension portions P1 toP4, which are connected to the second coupler 510 and extend to thefirst side portion 141-1 of the housing 140.

The body portion of each of the first to fourth upper elastic units150-1 to 150-4 may include the first coupler 520. The body portion ofeach of the first to fourth upper elastic units 150-1 to 150-4 mayfurther include at least one of the second coupler 510 and the connector530.

For example, using solder or a conductive adhesive member, one end ofthe first support member 220-1 may be coupled to the second coupler 510of the first upper elastic unit 150-1, and one end of the second supportmember 220-2 may be coupled to the second coupler 510 of the secondupper elastic unit 150-1. Furthermore, one end of the third supportmember 220-3 may be coupled to the second coupler 510 of the third upperelastic unit 150-3, and one end of the fourth support member 220-4 maybe coupled to the second coupler 510 of the fourth upper elastic unit150-4.

The second coupler 510 may have a hole 52 through which a correspondingone of the support members 220-1 to 220-4 extends. The one end of thecorresponding one of the support members 220-1 to 220-4, which haspassed through the hole 52, may be directly coupled to the secondcoupler 510 via a conductive adhesive member or solder 910 (see FIG. 10)and the second coupler 510 and the support members 220-1 to 220-4 may beconductively connected to each other.

For example, the second coupler 510, which is a region in which thesolder 910 is disposed for coupling to the support members 220-1 to220-4, may include the hole 52 and a region near the hole 52.

The first coupler 520 may include at least one coupling region (forexample, 5 a or 5 b) coupled to the housing (for example, the cornerportions 142-1 to 142-4).

For example, the coupling region (for example, 5 a or 5 b) of the firstcoupler 520 may have at least one hole 152 a coupled to the firstcoupler 143 of the housing 140.

For example, each of the coupling regions 5 a and 5 b may have thereinat least one hole, and each of the corner portions 142-1 to 142-4 of thehousing 140 may be correspondingly provided with at least one firstcoupler.

For example, in order to support the housing 140 in an equilibriumstate, although the coupling regions 5 a and 5 b of the first coupler520 of the first to fourth upper elastic units 150-1 to 150-4 may besymmetrically disposed with respect to reference lines (for example, 501and 502), the disclosure is not limited thereto.

Furthermore, although the first couplers 143 of the housing 140 may besymmetrically disposed with respect to the reference lines (for example,501 and 502) and may be provided such that two are located on each sideof each of the reference lines, the number thereof is not limitedthereto.

Each of the reference lines 501 and 502 may be a line that extendsbetween the central point 101 and one of the corners of the cornerportions 142-1 to 142-4 of the housing 140. For example, each of thereference lines 501 and 502 may be a line that extends through thecentral point 101 and two corners, which face each other in a diagonaldirection of the housing 140, among the corners of the corner portions142-1 to 142-4 of the housing 140.

Here, the central point 102 may be the center of the housing 140, thecenter of the bobbin 110, or the center of the upper elastic member 150.For example, the corner of each of the corner portions of the housing140 may be a corner that is aligned with or corresponds to the center ofa corresponding one of the corner portions of the housing 140.

In the embodiment shown in FIG. 9A, although each of the couplingregions 5 a and 5 b of the first couplers 520 is embodied as having thehole 152 a therein, the disclosure is not limited thereto. In anotherembodiment, each of the coupling regions may be embodied as havingvarious shapes, for example, a groove shape, suitable for coupling tothe housing 140.

For example, the hole 152 a in the first coupler 520 may have at leastone slit 52 a through which an adhesive member infiltrates between thefirst coupler 143 of the housing 140 and the hole 152 a.

The connector 530 may connect the second coupler 510 to the firstcoupler 520.

For example, the connector 530 may connect the second coupler 510 to thecoupling regions 5 a and 5 b of the first coupler 520.

For example, the connector 530 may include a first connector 530 a,connecting the first coupling region 5 a of the first coupler 520 ofeach of the first to fourth upper elastic units 150-1 to 150-4 to thesecond coupler 510, and a second connector 530 b, connecting the secondcoupling region 5 b of the first coupler 520 to the second coupler 510.

For example, although the first outer frame 151 may include a connectingregion directly connecting the first coupling region 5 a to the secondcoupling region 5 b, the disclosure is not limited thereto.

Although each of the first and second connectors 530 a and 530 b mayinclude a bent portion, which is bent at least once, or a curvedportion, which is curved at least once, the disclosure is not limitedthereto. In another embodiment, each of the first and second connectors530 a and 530 b may be linear.

The width of the connector 530 may be less than the width of the firstcoupler 520. Furthermore, the width of the connector 530 may be lessthan the width (or the diameter) of the first coupler. In anotherembodiment, the width of the connector 530 may be equal to the width ofthe first coupler 520, and may be equal to the width (or the diameter)of the first coupler.

For example, the first couplers 520 may be in contact with the uppersurfaces of the corner portions 142-1 to 142-4 of the housing 140, andmay be supported thereby. For example, the connector 530 may not besupported by the upper surface of the housing 140, and may be spacedapart from the housing 140. Furthermore, in order to inhibit oscillationcaused by vibration, the space between the connector 530 and the housing140 may be filled with a damper (not shown).

The width of each of the first and second connectors 530 a and 530 b maybe less than the width of the first coupler 520, thereby allowing theconnector 530 to be easily moved in the first direction. Consequently,it is possible to distribute the stress applied to the upper elasticunits 150-1 to 150-4 and the stress applied to the support members 220-1to 220-4.

Each of the first and second extension portions P1 and P2 of the firstouter frames of the first and second upper elastic units 150-1 and 150-2may extend toward a corresponding one of the first and second terminalsB1 and B2 of the circuit board 190, which are positioned at the firstside portion 141-1 of the housing 140, from the first coupler 520 (forexample, the first coupling region 5 a).

The first coupler 520 of the third upper elastic unit 150-3 may furtherinclude at least one coupling region 6 a, 6 b connected to at least oneof the fourth side portion 141-4 and the second corner portion 142-2 ofthe housing 140.

The first coupler 520 of the fourth upper elastic unit 150-4 may furtherinclude at least one coupling region 6 c, 6 d connected to at least oneof the second side portion 141-2 and the first corner portion 142-1 ofthe housing 140.

Each of the third and fourth extension portions P3 and P4 of the firstouter frames of the third and fourth upper elastic units 150-3 and 150-4may extend toward a corresponding one of the third and fourth terminalsB3 and B4 of the circuit board 190, which are positioned at the firstside portion 141-1 of the housing 140, from the first coupler 520 (forexample, the coupling region 6 b, 6 d).

One end of each of the first to fourth extension portions P1 to P4 maybe coupled to a corresponding one of the first to fourth terminals B1 toB4 of the circuit board 190 via solder or a conductive adhesive member.

Each of the first and second extension portions P1 and P2 may have alinear shape.

In order to facilitate coupling to a corresponding one of the third andfourth terminals B3 and B4 of the circuit board 190, each of the thirdand fourth extension portions P3 and P4 may include a bent or curvedportion.

The first outer frame of the third upper elastic unit 150-3 may furtherinclude a first extension frame 154-1, which is connected both to thefirst coupler 520 and to the extension portion P3 and is positioned atthe fourth side portion 141-4 and the fourth corner portion 142-4 of thehousing 140.

In order to increase the coupling force between the first extensionframe 154-1 and the housing 140 to thus inhibit the third upper elasticunit 150-3 from being lifted, the first extension frame 154-1 mayinclude at least one coupling region 6 a, 6 b coupled to the housing140, and each of the coupling regions 6 a and 6 b may have a hole forcoupling to the first coupler 143.

The first outer frame of the fourth upper elastic unit 150-4 may furtherinclude a second extension frame 154-2, which is connected both to thefirst coupler 520 and to the extension portion P4 and is positioned atthe second side portion 141-2 and the first corner portion 142-1 of thehousing 140.

In order to increase the coupling force between the second extensionframe 154-2 and the housing 140 and thus to inhibit the fourth upperelastic unit 150-4 from being lifted, the second extension frame 154-2may include at least one coupling region 6 c, 6 d coupled to the housing140, and each of the coupling regions 6 c and 6 d may have a hole forcoupling to the first coupler 143 of the housing 140.

Although each of the third upper elastic unit 150-3 and the fourth upperelastic unit 150-4 includes two first frame connectors in FIG. 9A, thedisclosure is not limited thereto. The number of first frame connectorsmay be one, or three or more.

As described above, each of the first to fourth upper elastic units mayinclude the extension portions P1 to P4 disposed at the first sideportion 141-1 of the housing 140. By virtue of the extension portions P1to P4, the upper elastic units 150-1 to 150-4 may be easily coupled tothe first to fourth terminals B1 to B4 provided at the body part S1 ofthe circuit board 190.

Because the four terminals B1 to B4 provided at the body part S1 of thecircuit board 190 disposed at the first side portion 141-1 of thehousing 140 are conductively and directly connected to the first tofourth upper elastic units 150-1 to 150-4, a portion of the first outerframe 151 of each of the first to fourth upper elastic units 150-1 to150-4 may be disposed at the first side portion 141-1 of the housing140.

Each of the upper elastic units 150-1 to 150-4 may be disposed at acorresponding one of the corner portions 142-1 to 142-4 of the housing140, and may include the extension portion P1 to P4 extending to thefirst side portion 141-1 of the housing 140.

Each of the extension portions P1 to P4 of each of the upper elasticunits 150-1 to 150-4 may be directly coupled to a corresponding one ofthe four terminals B1 to B4 provided at the body part S1 of the circuitboard 190 via a conductive adhesive member 71 such as solder.

The first outer frame 151 of the first upper elastic unit 150-1 may bedisposed at the first corner portion 142-1 of the housing 140, and thefirst outer frame 151 of the second upper elastic unit 150-2 may bedisposed at the second corner portion 142-2 of the housing 140. Thefirst outer frame 151 of the third upper elastic unit 150-3 may bedisposed at the third corner portion 142-3 of the housing 140, and thefirst outer frame 151 of the fourth upper elastic unit 150-4 may bedisposed at the fourth corner portion 142-4 of the housing 140.

A portion of the third upper elastic unit 150-3 may be disposed in thefirst groove 90 a in the first circuit board 190, and the end of theportion of the third upper elastic unit 150-3 may be coupled to thethird terminal B3 of the circuit board 190.

A portion of the fourth upper elastic unit 150-4 may be disposed in thesecond groove 90 b in the first circuit board 190, and the end of theportion of the fourth upper elastic unit 150-4 may be coupled to thefourth terminal B4 of the circuit board 190.

The third extension portion P3 of the third upper elastic unit 150-3 mayextend toward the third terminal B3 of the circuit board 190 through thefirst groove 90 a in the circuit board 190, and may be bent at leasttwice.

The fourth extension portion P4 of the fourth upper elastic unit 150-4may extend toward the fourth terminal B4 of the circuit board 190through the second groove 90 b in the circuit board 190, and may be bentat least twice.

The third extension portion (or “third connecting terminal”) P3 of thethird upper elastic unit 150-3 may include at least two bent regions 2 aand 2 b.

For example, the third extension portion P3 of the third upper elasticunit 150-3 may include a first portion 1 a extending from the firstcoupler 520 (for example, the coupling region 6 b) of the third upperelastic unit 150-3, the first bent region (or “first bent portion”) 2 abent at the first portion 1 a, a second portion 1 b extending from thefirst bent region 2 a, the second bent region (or “second bent portion”)2 b bent at the second portion 1 b, and a third portion 1 c extendingtoward the third terminal B3 from the second bent region 2 b.

For example, the second portion 1 b of the third extension portion (orthe third connecting terminal) P3 may be bent at the first portion 1 a,and the third portion 1 c may be bent at the second portion 1 b.

The second portion 1 b of the third extension portion P3 may be disposedbetween the first bent region 2 a and the second bent region 2 b, andmay connect the first and second bent regions 2 a and 2 b to each other.

For example, each of the first portion 1 a and the third portion 1 c ofthe third extension portion P3 may extend toward the first cornerportion 141-1 from the second corner portion 142-2 of the housing 140.For example, the second portion 1 b of the third extension portion P3may extend toward the outer surface from the inner surface of thehousing 140.

A portion (for example, the second portion 1 b) of the third extensionportion P3 of the third upper elastic unit 150-3 may be positioned inthe first groove 90 a in the circuit board 190, or may extend throughthe first groove 90 a.

The fourth extension portion (or “fourth connecting terminal”) P4 of thefourth upper elastic unit 150-4 may include at least two bent regions 2c and 2 d.

For example, the fourth extension portion P4 of the fourth upper elasticunit 150-4 may include a fourth portion 1 d extending from a firstcoupler 520 (for example, the coupling region 6 d) of the fourth upperelastic unit 150-4, the third bent region (or “third bent portion”) 2 cbent at the fourth portion 1 d, a fifth portion 1 e extending from thethird bent region 2 c, the fourth bent region (or “fourth bent portion”)2 d bent at the fifth portion 1 e, and a sixth portion 1 f extendingtoward the fourth terminal B4 from the fourth bent region 2 d.

For example, the fifth portion 1 e of the fourth extension portion (orthe fourth connecting terminal) P4 may be bent at the fourth portion 1d, and the sixth portion 1 f may be bent at the fifth portion 1 e.

The fifth portion 1 e of the fourth extension portion P4 may be disposedbetween the third bent region 2 c and the fourth bent region 2 d so asto connect the third and fourth bent regions 2 c and 2 d to each other.

For example, each of the fourth portion 1 d and the sixth portion 1 f ofthe fourth extension portion P4 may extend toward the second cornerportion 141-2 from the first corner portion 142-1 of the housing 140.For example, the fifth portion 1 e of the fourth extension portion P4may extend toward the outer surface from the inner surface of thehousing 140.

A portion (for example, the fifth portion 1 e) of the fourth extensionportion P4 of the fourth elastic unit may be positioned in the secondgroove 90 b in the circuit board 190, or may extend through the secondgroove 90 b.

Referring to FIG. 9B, the lower elastic member 160 may include aplurality of lower elastic units 160-1 and 160-2.

For example, each of the first and second lower elastic units 160-1 and160-2 may include the second inner frame 161 coupled or fixed to thelower portion, the lower surface or the lower end of the bobbin 110, thesecond outer frames 162-1 to 162-3 coupled or fixed to the lowerportion, the lower surface or the lower end of the housing 140, and thesecond frame connector 163 connecting the second inner frame 161 to thesecond outer frames 162-1 to 162-3.

The second inner frame 161 may have therein a hole 161 a for coupling tothe second coupler 117 of the bobbin 110, and the second outer frames162-1 to 162-3 may have therein holes 162 a for coupling to the secondcoupler 149 of the housing 140.

For example, although each of the first and second lower elastic units160-1 and 160-2 may include three second outer frames 162-1 to 162-3 andtwo second frame connectors 163, which are coupled to the housing 140,the disclosure is not limited thereto. In another embodiment, each ofthe first and second lower elastic units may include at least one secondouter frame and at least one second frame connector.

Each of the first and second lower elastic units 160-1 and 160-2 mayinclude connecting frames 164-1 and 164-2, which connect the secondouter frames 162-1 and 162-3 to each other.

Although the width of each of the connecting frames 164-1 and 164-2 maybe less than the widths of the second outer frames 162-1 to 162-3, thedisclosure is not limited thereto.

In order to avoid spatial interference with the second coil 230 and thefirst magnet 130, the connecting frames 164-1 and 164-2 may bepositioned outside the coil units 230-1 to 230-4 and the first magnets130-1 to 130-4. Here, the outside of the coil units 230-1 to 230-4 andthe first magnets 130-1 to 130-4 may be the side opposite the center ofthe bobbin 110 or the housing 140 with respect to the coil units 230-1to 230-4 and the first magnets 130-1 to 130-4.

For example, although the connecting frames 164-1 and 164-2 may bepositioned so as not to overlap the coil units 230-1 to 230-4 and/or thefirst magnets 130-1 to 130-4 in the optical-axis direction, thedisclosure is not limited thereto. In another embodiment, at leastportions of the connecting frames 164-1 and 164-2 may be aligned with oroverlap the coil units 230-1 to 230-4 and/or the first magnets 130-1 to130-4 in the optical-axis direction.

Each of the upper elastic units 150-1 to 150-4 and the upper elasticunits 160-1 and 160-2 may be embodied as a leaf spring. However, theupper elastic unit is not limited thereto, and may be embodied as a coilspring or the like. The above-mentioned elastic unit (for example, 150or 160) may be alternatively referred to as a “spring”, and the outerframe (for example, 152 or 162) may be alternatively referred to as an“outer portion”. Furthermore, the inner frame (for example, 151 or 161)may be alternatively referred to as an inner portion, and the supportmember (for example, 220) may be alternatively referred to as a wire.

Next, the support members 220-1 to 220-4 will be described.

The support members 220-1 to 220-4 may be disposed at the cornerportions 142-1 to 142-4 of the housing 140 so as to connect the upperelastic units 150-1 to 150-4 to the circuit board 250.

Each of the support members 220-1 to 220-4 may be coupled to acorresponding one of first to fourth upper elastic units 150-1 to 150-4,and may conductively connect a corresponding one of the first to fourthupper elastic units 150-1 to 150-4 to a corresponding one of theterminals 21-1 to 21-n (n=4) of the circuit board 250.

The support members 220-1 to 220-4 may be spaced apart from the housing140, rather than being fixed to the housing 140. One end of each of thesupport members 220-1 to 220-4 may be directly connected or coupled tothe second coupler 510, and the other end of each of the support members220-1 to 220-4 may be directly connected or coupled to the circuit board250.

For example, although the support members 220-1 to 220-4 may extendthrough the holes 147 formed in the corner portions 142-1 to 142-4 ofthe housing 140, the disclosure is not limited thereto. In anotherembodiment, the support members may be disposed adjacent to the boundaryline between the side portions 141-1 to 141-4 and the corner portions142-1 to 142-4 of the housing 140, and may not extend through the cornerportions 142-1 to 142-4 of the housing 140.

The first coil 120 may be directly connected or coupled to acorresponding one of the second inner frames of the first and secondlower elastic units 160-1 and 160-2. For example, the second inner frame161 of the first lower elastic unit 160-1 may include a first bondingportion 43 a coupled to one end of the first coil 120, and the secondinner frame 161 of the second lower elastic unit 160-2 may include asecond bonding portion 43 b coupled to the other end of the first coil120. Each of the first and second bonding portions 43 a and 43 b mayhave a groove 8 a for guiding the coil 120.

The first terminal B1 of the circuit board 190 may be conductivelyconnected to the first support member 220-1 through the first upperelastic unit 150-1, and the second terminal B2 of the circuit board 190may be conductively connected to the second support member 220-2 throughthe second upper elastic unit 150-2. The third terminal B3 of thecircuit board 190 may be conductively connected to the third supportmember 220-3 through the fourth upper elastic unit 150-4, and the fourthterminal B4 of the circuit board 190 may be conductively connected tothe fourth support member 220-4 through the third upper elastic unit150-3.

Each of the first to fourth upper elastic units 150-1 to 150-4 may becoupled to a corresponding one of the first to fourth support members220-1 to 220-4, and each of the first to fourth support members 220-1 to220-4 may be conductively connected to a corresponding one of the firstto fourth terminals 21-1 to 21-n (n=4) of the circuit board 250.

Each of the first and second lower elastic units 160-1 and 160-2 may beconductively connected to the first coil 120, and a corresponding one ofthe fifth and sixth terminals B5 and B6 of the circuit board 190 may beconnected or coupled to the second outer frame 162-1.

For example, the power signals VDD and GND may be supplied to the firstand second support members 220-1 and 220-2 through the first and secondterminals 21-1 and 21-2 of the circuit board 250.

The power signals VDD and GND may be supplied to the first and secondterminals B1 and B2 of the circuit board 190 through the first andsecond upper elastic units 150-1 and 150-2. The first position sensor170 may receive the power signals VDD and GND through the first andsecond terminals B1 and B2 of the circuit board 190.

For example, the first terminal B1 of the circuit board 190 may be oneof a VDD terminal and a GND terminal, and the second terminal B2 of thecircuit board 190 may be the other of the VDD terminal and the GNDterminal.

Furthermore, the clock signal SCL and the data signal SDA may besupplied to the third and fourth support members 220-3 and 220-4 throughthe third and fourth terminals 21-3 and 21-4 of the circuit board 250,and the clock signal SCL and the data signal SDA may be supplied to thethird and fourth terminals B3 and B4 through the third and fourthsupport members 220-3 and 220-4 and the third and fourth upper elasticunits 150-3 and 150-4. The first position sensor 170 may receive theclock signal SCL and the data signal SDA through the third and fourthterminals B3 and B4 of the circuit board 190.

For example, the power signal VDD may be supplied to the first positionsensor 170 through the first terminal 21-1 of the circuit board 250, thefirst support member 220-1, the first upper elastic unit 150-1, and thefirst terminal B1 of the circuit board 190. The power signal GND may besupplied to the first position sensor 170 through the second terminal21-2 of the circuit board 250, the second support member 220-2, thesecond upper elastic unit 150-2, and the second terminal B2 of thecircuit board 190.

For example, the clock signal SCL may be supplied to the first positionsensor 170 through the third terminal 21-3 of the circuit board 250, thethird support member 220-3, the third upper elastic unit 150-3, and thethird terminal B3 of the circuit board 190. The data signal SDA may besupplied to the first position sensor 170 through the fourth terminal21-4 of the circuit board 250, the fourth support member 220-4, thefourth upper elastic unit 150-4, and the fourth terminal B4 of thecircuit board 190.

Each of the fifth and sixth terminals B5 and B6 of the circuit board 190may be connected or coupled to the second outer frame 162-1 of acorresponding one of the first and second lower elastic units 160-1 and160-2.

The second outer frame 162-1 of the first lower elastic unit 160-1 mayinclude a first bonding portion 81 a, to which the fifth terminal B5 ofthe circuit board 190 is coupled via solder or a conductive adhesivemember. The second outer frame 162-1 of the second lower elastic unit160-2 may include a second bonding portion 81 b, to which the sixthterminal B6 is coupled via solder or a conductive adhesive member.

For example, the second outer frame 162-1 of the first lower elasticunit 160-1 may include a first hole (or a first groove) 82 a, in whichthe fifth terminal B5 of the circuit board 190 is inserted or disposed,and the second outer frame 162-1 of the second lower elastic unit 160-2may include a second hole (or a second groove) 82 b, in which the sixthterminal B6 of the circuit board 190 is inserted or disposed.

For example, although each of the first and second holes 82 a and 82 bmay be formed through the second outer frame 162-1 and may have anopening, which is open at one side of the second outer frame 162-1, thedisclosure is not limited thereto. In another embodiment, each of thefirst and second holes 82 a and 82 may not have the opening in one sideof the second outer frame 162-1.

Since the fifth terminal B5 (or the sixth terminal B6) is coupled to thefirst bonding portion 81 a (or the sixth bonding portion 81 b), in whichthe first groove 82 a (or the second groove 82 b) is formed, in thestate in which the fifth terminal B5 (or the sixth terminal B6) of thecircuit board 190 is inserted into the first groove 82 a (or the secondgroove 82 b) in the second outer frame 162-1 of the first lower elasticunit 160-1, it is possible to increase the coupling area and thus toincrease the coupling force and improve solderability between theterminal and the bonding portion.

Referring to FIG. 11B, one end (for example, the lower end or the lowersurface) of each of the fifth and sixth terminals B5 and B6 may bepositioned lowered than the lower end or the lower surface of the secondouter frame 162-1 of the first and second lower elastic units 160-1 and160-2. Because FIG. 11B is a bottom view, the lower surface of each ofthe fifth and sixth terminals B5 and B6 may be shown as being positionedlower than the lower end or the lower surface of the second outer frame162-1. The reason for this is to improve solderability between one endof each of the fifth and sixth terminals B5 and B6 and the first andsecond bonding portions 81 a and 81 b of the first and second lowerelastic units 160-1 and 160-2.

Referring to FIG. 11B, the housing 140 may have a groove 31, which isdepressed from the lower surface of the first side portion 141-1. Forexample, the bottom surface of the groove 31 in the housing 140 may havea height difference with respect to the lower surface of the housing 140in the optical-axis direction. For example, the bottom surface of thegroove 31 in the housing 140 may be positioned higher than the lowersurface of the housing 140.

The groove 31 in the housing 140 may overlap the first and secondbonding portions 81 a and 81 b of the first and second lower elasticunits 160-1 and 160-2 in the optical-axis direction.

Furthermore, the groove 31 in the housing 140 may overlap the holes 82 aand 82 b in the second outer frames 162-1 of the first and second lowerelastic units 160-1 and 160-2 in the optical-axis direction.

By virtue of the groove 31 in the housing 140, it is possible toincrease the surface area of the fifth and sixth terminals B5 and B6that is exposed through the housing, and it is possible to ensure aspace in which to seat solder or a conductive adhesive member.Consequently, it is possible to improve solderability and to reduce thedistance that the solder projects downwards from the lower surface ofthe second outer frame 162-1, whereby it is possible to suppress orinhibit spatial interference with the second coil 230, the circuit board250 or the base 210 disposed under the lower elastic unit.

Although the lower surface 11 c of the first magnet 130 disposed in theseating portion 141 a in the housing 140 may be positioned lower thanthe lower surface of the housing 140 and the lower surfaces of thesecond outer frames 162-1 to 162-3 of the first and second lower elasticunits 160-1 and 160-2, the disclosure is not limited thereto. In anotherembodiment, the lower surface 11 c of the first magnet 130 may bepositioned higher than the lower surface of the housing 140 in order toreduce spatial interference with the second position sensor 240. In afurther embodiment, the lower surface 11 c of the first magnet 130 mayhave a height that is higher than or equal to the height of the lowersurface of the housing 140.

In order to space the first magnet 130 apart from the second coil 230and the circuit board 250, the other end of the support member 220 maybe coupled to the circuit board 250 (or the circuit member 231) at alevel lower than the lower surface 11 c of the first magnet 130.

Each of the support members 220 may be embodied as a member that isconductive and offers elastic support, for example, a suspension wire, aleaf spring, or a coil spring. In another embodiment, the supportmembers 220 may be integrally formed with the upper elastic member 150.

Next, the base 210, the circuit board 250, and the second coil 230 willbe described.

Referring to FIG. 12A, the base 210 may have a bore corresponding to thebore in the bobbin 110 and/or the bore or hollow 205 in the housing 140,and may have a shape corresponding to or coinciding with that of thecover member 300, for example, a square shape. For example, the bore inthe base 210 may be a through hole, which is formed through the base 210in the optical-axis direction.

The base 210 may include a step 211, to which an adhesive is appliedwhen the cover member 300 is secured to the base 210 via adhesion. Forexample, the step 211 may be formed on the outer surface of the base210. Here, the step 211 may guide the side plate of the cover member300, which is coupled to the upper side of the base, and the lower endof the side plate of the cover member 300 may be in contact with thestep 211. The step 211 of the base 210 may be bonded or fixed to thelower end of the side plate of the cover member 300 via an adhesive orthe like.

The region of the base 210 that faces the terminal member 253 at whichterminals 21-1 to 21-n of the circuit board 250 are provided, may beprovided with a support 255. The support 255 may support the terminalmember 253 of the circuit board 250 at which the terminals 21-1 to 21-nof the circuit board 250 are formed.

The base 210 may have recesses 212 in corner regions thereofcorresponding to the corners of the cover member 300. When the cornersof the cover member 300 have projections, the projections of the covermember 300 may be coupled to the recesses 212 in the base 210.

The lower surface of the base 210 may be provided with a seating portion(not shown) to which the filter 610 of the camera module 200 is mounted.

The upper surface of the base 210 around the bore may be provided with aprojection 19, which is coupled to the bore in the circuit board 250 andthe bore in the circuit member 231.

The base 210 may include guide portions 29-1 to 29-3, which areconfigured to guide disposition of the coil units 230-1 to 230-4 whenthe coil units 230-1 to 230-4 are disposed on the upper surface of thecircuit board 250.

For example, the base 210 may include the guide portions 29-1 and 29-2,which project from a region of the upper surface of the base 210adjacent to the corner or the recess 212 of the base 210.

For example, the first guide portion 29-1 may be formed adjacent to oneside of the base 210, which is adjacent to the corner or the recess 212in the base 210, and the second guide portion 29-2 may be formedadjacent to the other side of the base 210, which is adjacent to thecorner or the recess 212 in the base 210. Each of the first guideportion 29-1 and the second guide portion 29-2 may project in theoptical-axis direction or upwards from the upper surface of the base210.

The base 210 may include the third guide portion 29-3 formed at theprojection 19 of the base 210.

The third guide portion 29-3 may project in the optical-axis directionor upwards from the upper surface of the base 210, and may projecttoward the corner or the recess 212 in the base 210 from the outercircumferential surface or the outer surface of the projection 19.

For example, although lines that connect the first to third guideportions 29-1 to 29-3 to one another, may define a triangular shape, thedisclosure is not limited thereto.

Referring to FIG. 14, each of the coil units 230-1 to 230-4 may includea first linear portion 31A and a second linear portion 31 b, which faceeach other, a first connecting portion 31 c connecting a first end ofthe first linear portion 31A to a first end of the second linear portion31 b, and a second connecting portion 31D connecting the second end ofthe first linear portion 31A to the second end of the second linearportion 31B.

The first linear portion 31A may be positioned closer to the bore 205 inthe circuit board 250 or the projection 19 of the base 210 than is thesecond linear portion 31B, and the crosswise length of the first linearportion 31A may be greater than the crosswise length of the secondlinear portion 31B. Here, the crosswise direction may be thelongitudinal direction of the first and second linear portions 31A and31B, which is perpendicular to the optical axis.

Each of the first connecting portion 31C and the second connectingportion 31D may include at least one bent portion.

The first guide portion 29-1 may be in contact with the first connectingportion 31C so as to guide the first connecting portion 31C, the secondguide portion 29-2 may be in contact with the second connecting portion31D so as to guide the second connecting portion 31D, and the thirdguide portion 29-3 may be in contact with the first linear portion 31Aso as to guide the first linear portion 31A.

For example, the first guide portion 29-1 may be in contact with theouter circumferential surface or the outer surface of the firstconnecting portion 31C, the second guide portion 29-2 may be in contactwith the outer circumferential surface or the outer surface of thesecond connecting portion 31D, and the third guide portion 29-3 may bein contact with the outer circumferential surface or the outer surfaceof the first linear portion 31A.

The second coil 230 and the first and second sensors 240 a and 240 b maybe disposed at the upper portion of the circuit board 250. For example,the second coil 230 and the first and second sensors 240 a and 240 b maybe disposed, mounted or coupled to the upper surface of the circuitboard 250.

The second coil 230 may include the first sensor 240 a and the secondsensor 240 b.

The first and second sensors 240 a and 240 b may detect displacement ofthe OIS operation unit, for example, shift or tilt of the OIS operationunit in a direction perpendicular to the optical axis. Here, the OISoperation unit may include the AF operation unit and the componentsmounted on the housing 140.

The first position sensor 170 may be alternatively referred to as an “AFposition sensor”, and the second position sensor 240 may bealternatively referred to as an “OIS position sensor”.

For example, the OIS operation unit may include the AF operation unitand the housing 140. In some embodiments, the OIS operation unit mayfurther include the first magnet 130. For example, the AF operation unitmay include the bobbin 110 and components that are mounted on the bobbin110 and are moved therewith. For example, the AF operation unit mayinclude the bobbin 110, as well as the lens (not shown), the first coil120, the second magnet 180, and the third magnet 185, which are mountedon the bobbin 110.

The circuit board 250 may be disposed on the upper surface of the base210, and may have therein the bore corresponding to the bore in thebobbin 110, the bore in the housing 140 and/or the bore in the base 210.The bore in the circuit board 250 may be a through hole.

The circuit board 250 may have a shape coinciding with or correspondingto the upper surface of the base 210, for example, a quadrilateralshape.

The circuit board 250 may include at least one terminal member 253,which is bent from the upper surface of the circuit board and which isprovided with a plurality of terminals 21-1 to 21-n (n being a naturalnumber) or pins to which electrical signals are suppled from theoutside.

The second coil 230 may be disposed under the housing 140 and the bobbin110.

The second coil 230 may be disposed at the upper portion of the circuitboard 250 so as to correspond to, face or overlap the first magnets130-1 to 130-4 disposed at the housing 140, in the optical-axisdirection.

For example, the second coil 230 may include a plurality of coil units230-1 to 230-4.

Each of the plurality of coil units 230-1 to 230-4 of the second coil230 may face or overlap a corresponding one of the first magnets 130-1to 130-4 disposed at the corner portions 142-1 to 142-4 of the housing140 in the optical-axis direction.

Although each of the coil units may have the form of a coil blockcomposed of an FP (fine pattern) coil, the disclosure is not limitedthereto.

In another embodiment, the second coil may include the circuit memberand a plurality of coil units formed at the circuit member. Here, thecircuit member 231 may also be referred to as a “board”, “circuitboard”, or “coil board”. Here, the first and second sensors 240 a and240 b may be disposed or mounted on the upper surface of the circuitmember, and the circuit member may be conductively connected to thecircuit board 250. In other words, the first and second sensors may beconductively connected to the terminals of the circuit board 250 via thecircuit member.

In a further embodiment, the first and second sensors 240 a and 240 bmay be disposed between the circuit board 250 and the base 210. Forexample, the first and second sensors 240 a and 240 b may be disposed ormounted on the lower surface of the circuit board 250.

In yet a further embodiment, the coil units may be directly formed inthe circuit board 250.

The four coil units 230-1 to 230-4 may be disposed or formed at thecorners or the corner regions of the polygonal (for example,rectangular) circuit board 250.

For example, although the second coil 230 may include two coil units230-1 and 230-3 for movement in the second direction (for example, thex-axis direction) and two coil units 230-2 and 230-4 for movement in thethird direction (for example, the y-axis direction), the disclosure isnot limited thereto.

For example, the coil units 230-1 and 230-3 for movement in the seconddirection may be disposed at two corner regions of the circuit board250, which face each other in the first diagonal direction of thecircuit board 250, and the coil units 230-2 and 230-4 for movement inthe third direction may be disposed at the other two corner regions ofthe circuit board 250, which face each other in the second diagonaldirection of the circuit board 250. The first diagonal direction may bea direction perpendicular to the second diagonal direction.

In another embodiment, the second coil 230 may include only one coilunit for movement in the second direction and only one coil unit formovement in the third direction, or may include four or more coil units.

The electromagnetic force resulting from the interaction between thecoil units 230-1 and 230-3 for movement in the second direction and thefirst magnets 130-1 and 130-3, which correspond to the coil units 230-1and 230-3 in the optical-axis direction, may be exerted in the samedirection. Furthermore, the electromagnetic force resulting from theinteraction between the coil units 230-2 and 230-4 for movement in thethird direction and the first magnets 130-2 and 130-4, which correspondto the coil units 230-1 and 230-3 in the optical-axis direction, may beexerted in the same direction.

The second coil 230 may be conductively connected to the circuit board250, and may be provided with power or drive signals from the circuitboard 250. The power or drive signals supplied to the second coil 230may be DC or AC signals, or may include both DC and AC components, andmay be of a current type or a voltage type.

By virtue of the interaction between the first magnets 130-1 to 130-4and the second coil units 230-1 to 230-4 to which the drive signals aresupplied, the housing 140 may be moved in the second direction and/or inthe third direction, for example, in an x-axis direction and/or in ay-axis direction, thereby performing handshake correction.

Referring to FIG. 13, the circuit board 250 may include pads PX1 to PX4and PY1 to PY4, which are conductively connected to the coil units 230-1to 230-4. Here, the pads PX1 to PX4 and PY1 to PY4 may be alternativelyreferred to as “terminals” or “bonding portions”.

For example, one end of the first coil unit 230-1 may be connected tothe first pad PX1, and the other end of the first coil unit 230-1 may beconnected to the second pad PX2. One end of the third coil unit 230-3may be connected to the third pad PX3, and the other end of the thirdcoil unit 230-3 may be connected to the fourth pad PX4. The second padPX2 and the third pad PX3 may be connected to each other via the firstcircuit pattern (or the first wire) formed in the circuit board 250.Consequently, the two coil units 230-1 and 230-3 for movement in thesecond direction may be connected to each other in series via the firstto fourth pads PX1 to PX3.

Furthermore, one end of the second coil unit 230-2 may be connected tothe fifth pad PY1, and the other end of the second coil unit 230-2 maybe connected to the sixth pad PY2. One end of the fourth coil unit 230-4may be connected to the seventh pad PY3, and the other end of the fourthcoil unit 230-4 may be connected to the eighth pad PY4. The sixth padPY2 and the seventh pad PY3 may be connected to each other via thesecond circuit pattern (or the second wire) formed in the circuit board250. Consequently, the two coil units 230-2 and 230-4 for movement inthe third direction may be connected to each other in series via thefifth to eighth pads PY1 to PY4.

A second drive signal for the two coil units 230-1 and 230-3 formovement in the second direction may be supplied to the first pad PX1and the fourth pad PX4 of the circuit board 250, and a third drivesignal for the two coil units 230-2 and 230-4 for movement in the seconddirection may be supplied to the fifth pad PY1 and the eighth pad PY4 ofthe circuit board 250.

As described later, when each of the first and second sensors 240 a and240 b is composed of a driver integrated circuit including a Hallsensor, the first sensor 240 a may be conductively connected to thefirst pad PX1 and the fourth pad PX4 of the circuit board 250, and mayprovide the first pad PX1 and the fourth pad PX4 of the circuit board250 with the second drive signal.

Furthermore, the second sensor 240 b may be conductively connected tothe fifth pad PY1 and the eighth pad PY4 of the circuit board 250, andmay provide the fifth pad PY1 and the eighth pad PY4 of the circuitboard 250 with the third drive signal.

In another embodiment, in which each of the first and second sensors 240a and 240 b is embodied as only one Hall sensor, via two terminalsformed on the terminal member of the circuit board 250, the second drivesignal may be supplied to the first pad PX1 and the fourth pad PX4 ofthe circuit board 250 from the outside, and the third drive signal maybe supplied to the fifth pad PY1 and the eighth pad PY4 from theoutside. Here, the outside may be a controller of a camera module or acontroller of an optical device.

In FIGS. 13 and 14, although each of the coil units 230-1 to 230-4 isembodied as a ring-shaped coil block, for example, a coil ring, which isprepared separately from the circuit board 250, the disclosure is notlimited thereto.

In another embodiment, the coil unit may be prepared separately from thecircuit board 250, and may be embodied as a circuit pattern formed at apolygonal (for example, a rectangular) circuit member.

In another embodiment, the coil units 230-1 to 230-4 may be embodied soas to have a circuit pattern directly formed at the circuit board 250,for example, an FP coil form.

Each of the first and second sensors 240 a and 240 b may be of a drivertype including a Hall sensor. In another embodiment, each of the firstand second sensors 240 a and 240 b may be a Hall sensor.

The terminal member 253 of the circuit board 250 may be provided withthe terminals 21-1 to 21-n (n being a natural number greater than 1,n>1).

Via the plurality of terminals 21-1 to 21-n provided at the terminalmember 253 of the circuit board 250, the signals SCL, SDA, VDD and GNDfor data communication with the first position sensor 170 may betransmitted and received.

When each of the first and second sensors 240 a and 240 b is of a driveIC type, signals for data communication with each of the first andsecond sensors 240 a and 240 b may be transmitted and received throughthe plurality of terminals 21-1 to 21-n provided on the terminal member253 of the circuit board 250. A description thereof will be given later.

When each of the first and second sensors 240 a and 240 b is embodied asonly one Hall sensor, the second and third drive signals may be suppliedthrough the plurality of terminals 21-1 to 21-n provided on the terminalmember 253 of the circuit board 250, and the signals output from the OISposition sensors 240 a and 240 b may be output to the outside.

In the embodiment, although the circuit board 250 may be an FPCB, thedisclosure is not limited thereto, and the pads PX1 to PX4 and PY1 toPY4 of the circuit board 250 may be directly formed on the surface ofthe base 210 through surface electrode technology or the like in anotherembodiment.

The circuit board 250 may have holes 250 a through which the supportmembers 220-1 to 220-4 extend. The positions and number of holes 250 amay correspond to or coincide with the positions and number of thesupport members 220-1 to 220-4.

Although the support members 220-1 to 220-4 may be conductivelyconnected to pads (or a circuit pattern) formed on the lower surface ofthe circuit board 250 through the holes 250 a in the circuit board 250via solder or a conductive adhesive member, the disclosure is notlimited thereto.

In another embodiment, the circuit board 250 may not have holes formedtherein, and the support members 220-1 to 220-4 may be conductivelyconnected to a circuit pattern or to pads formed on the upper surface ofthe circuit board 250 via solder, a conductive adhesive member or thelike.

In a further embodiment, the support members 220-1 to 220-4 may connectthe upper elastic units 150-1 to 150-4 to the circuit member at whichthe coil units are formed, and the circuit member may be conductivelyconnected to the circuit board 250.

Since the embodiment is constructed such that drive signals are directlysupplied to the first coil 120 from the first position sensor 170, it ispossible to reduce the number of support members and to simplify theconductive connecting structure, compared to the case in which drivesignals are directly supplied to the first coil 120 via the circuitboard 250.

As described later, since the drive signals are directly supplied to thecoil units 230-1 to 230-4 from the first and second sensors 240 a and240 b, it is possible to reduce the number of terminals of the circuitboard 250.

Furthermore, since each of the first position sensor 170 and the firstand second sensors 240 a and 240 b is capable of being embodied as adrive IC capable of detecting temperature, it is possible to improve theaccuracy of AF operation, regardless of temperature variation, bycompensating the output of the hall sensor so as to minimize a changethereof in response to variation in temperature or by compensating theoutput of the Hall sensor so as to change linearly with changes intemperature.

The cover member 300 may accommodate the bobbin 110, the first coil 120,the magnet 130, the housing 140, the upper elastic member 150, the lowerelastic member 160, the first position sensor 170, the second magnet180, the circuit board 190, the support member 220, the second coil 230,the second position sensor 240 and the circuit board 150 in the spacedefined between the cover member 300 and the base 210.

The cover member 300 may be configured to have a box shape, which isopen at the lower face thereof and includes the upper plate 301 and theside plates 302. The lower portion of the cover member 300 may becoupled to the upper portion of the base 210. The upper plate 301 of thecover member 300 may have a polygonal shape, for example, a squareshape, an octagonal shape, or the like.

The cover member 300 may have a bore, which exposes a lens (not shown)coupled to the bobbin 110 to external light. Although the cover member300 may be made of made of a nonmagnetic material such as stainlesssteel so as to inhibit a phenomenon in which the cover member 300 isattracted to the first magnet 130, the disclosure is not limitedthereto. The cover member 300 may also be made of a magnetic material soas to serve as a yoke for increasing the electromagnetic force betweenthe first coil 120 and the first magnet 130.

Referring to FIGS. 12A to 15, one coil unit 230-1 for movement in thesecond direction may be disposed in a first region on the upper surfaceof the circuit board 250, which is positioned between the first corner25B1 of the circuit board 250 and the bore (or the hollow) 205 in thecircuit board 250.

Another coil unit 230-3 for movement in the second direction may bedisposed in a second region on the upper surface of the circuit board250, which is positioned between the third corner 25B3 of the circuitboard 250 and the bore (or the hollow) 205 in the circuit board 250.

Another coil unit 230-2 for movement in the third direction may bedisposed in a third region on the upper surface of the circuit board250, which is positioned between the second corner 25B2 of the circuitboard 250 and the bore (or the hollow) 205 in the circuit board 250.

The remaining coil unit 230-4 for movement in the third direction may bedisposed in a fourth region on the upper surface of the circuit board250, which is positioned between the fourth corner 26B4 of the circuitboard 250 and the bore (or the hollow) 205 in the circuit board 250.

The first sensor 240 a may be disposed on the upper surface of thecircuit board 250 inside the coil unit 230-1 for movement in the seconddirection.

The second sensor 240 b may be disposed on the upper surface of thecircuit board 250 inside the coil unit 230-2 for movement in the thirddirection.

Although the first sensor 240 a may not overlap the first coil unit230-1 in the optical-axis direction and the second sensor 240 b may notoverlap the second coil unit 230-2 in the optical-axis direction, thedisclosure is not limited thereto. In another embodiment, the sensor andthe coil unit may at least partially overlap each other in theoptical-axis direction.

Although the first sensor 240 a may overlap the magnet 130-1 in theoptical-axis direction and the second sensor 240 b may overlap themagnet 130-2 in the optical-axis direction, the disclosure is notlimited thereto. In another embodiment, the first and second sensors 240a and 240 b may not overlap the magnets 130-1 to 130-4 in theoptical-axis direction.

The first sensor 240 a may be disposed between the first pad PX1 and thesecond pad PX2 of the circuit board 250, and the second sensor 240 b maybe disposed between the fifth pad PY1 and the sixth pad PY2 of thecircuit board 250.

For example, the first sensor 240 a may overlap a first line 13A, whichconnects the first corner 25B1 of the circuit board 250 to the center25A of the bore 205 in the circuit board 250. The second sensor 240 bmay overlap a second line 13B, which connects the second corner 25B2 ofthe circuit board 250 to the center 25A of the bore 205 in the circuitboard 250.

For example, the center of the first sensor 240 a may be aligned with oroverlap the first line 13A, and the center of the second sensor 240 bmay be aligned with or overlap the second line 13B. The first line 13Aand the second line 13B may be perpendicular to each other.

Referring to FIG. 15, a first height H1 of the upper surface of the coilunit 230-1 from the upper surface of the circuit board 250 may be lessthan or equal to the second height H2 of the upper surface of the firstsensor 240 a from the upper surface of the circuit board 250 (H1 H2).Furthermore, the height of the upper surface of the coil unit 230-2 fromthe upper surface of the circuit board 250 may be less than or equal tothe height of the second sensor 240 b from the upper surface of thecircuit board 250. In another embodiment, the first height may begreater than the second height.

There is a close relationship between the height of a camera module andthe height of a cellular phone. Although there is great demand forreduction in the height of a camera module, it is not easy to reduce theheight of the camera module due to the consequent low reliability of thecamera module and technological limits.

A conventional process of coupling and mounting an OIS sensor, a circuitboard and a base of a lens moving apparatus is as follows.

First, SMT (Surface-Mounting Technology) for mounting the OIS sensor onthe lower surface of the circuit board is performed.

Subsequently, the OIS coil is attached to the upper surface of thecircuit board using an adhesive, and the adhesive is hardened.

Subsequently, an SMT process of connecting the OIS coil to the pad onthe upper surface of the circuit board for the purpose of conductiveconnection is performed.

Subsequently, the lower surface of the circuit board is attached to theupper surface of the base using an adhesive, and the adhesive ishardened.

In contrast, the process according to the embodiment of coupling andmounting the second sensor 240, the circuit board 250 and the base 210of the lens moving apparatus is as follows.

First, an SMT process of mounting the first and second sensors 240 a and240 b of the second position sensor 240 and the coil units 230-1 to230-4 of the second coil 230 on the upper surface of the circuit board250 is performed. If necessary, the second coil 230 may be attached tothe upper surface of the circuit board 250 using an adhesive.

Subsequently, the lower surface of the circuit board 250 is attached tothe upper surface of the base 210 using an adhesive, and the adhesive ishardened. In another embodiment, an insert technology for forming acircuit at the base 210 may be applied in place of the circuit board250.

Since the embodiment is able to perform the SMT process of mounting boththe second sensor 240 and the second coil 230 on the upper surface ofthe circuit board 250, it is possible to reduce the number of operationsof the process and thus to reduce manufacturing costs.

Furthermore, since the second position sensor 240 is disposed on theupper surface of the circuit board 250 according to the embodiment,there is no need to form a seating groove by which the second positionsensor 240 is seated or disposed in the base 210, thereby making itpossible to reduce the height of the base 210. Accordingly, theembodiment is able to increase the length of the support member 220without increasing the height of the lens moving apparatus or a cameramodule. As a result, it is possible to improve the reliability of thelens moving apparatus and the camera module and to reduce powerconsumption.

In comparison with an FP coil in which four coils for second and thirddirections are integrally formed, since the embodiment is able tomanufacture each of the coil units 230-1 to 230-4 so as to have the formof a coil block, it is possible to increase the number of manufacturedOIS coils per unit area and thus to improve the production yield.

Furthermore, since an SMT process of concurrently mounting the secondposition sensor 240 and the second coil 230 on the upper surface of thecircuit board 250 is possible, it is possible to realize productionautomation.

FIG. 16A is a block diagram illustrating the supply of power signals VDDand VSS, a data signal SDA, and a clock signal SCL to the first positionsensor 170, the first sensor 240 a and the second sensor 240 b accordingto an embodiment. FIG. 16B is a circuit diagram of the first positionsensor 170, the first sensor 240 a and the second sensor 240 b shown inFIG. 16A.

Referring to FIGS. 16A and 16B, each of the first position sensor 170,the first sensor 240 a, and the second sensor 240 b may be of a driverIC type.

The first sensor 240 a may include a Hall sensor 61B and a driver 62B.Furthermore, the first sensor 340 a may further include atemperature-sensing element or a temperature sensor 63B, configured toprovide the driver 62B with a temperature-sensing signal Ts2.

The driver 62B of the first sensor 240 a may output a second drivesignal Id2 to drive the Hall sensor 61B and a second drive signal Id2 todrive the coil units 230-1 and 230-3 for movement in the seconddirection. The driver 62B of the first sensor 240 a may receive theoutput of the Hall sensor 61B.

The second sensor 240 b may include a Hall sensor 61C and a driver 62C.The second sensor 240 b may further include a temperature-sensingelement or a temperature sensor 63C, configured to provide the driver62C with a temperature-sensing signal Ts3.

The driver 62C of the second sensor 240 b may output a drive signal dV3to drive the Hall sensor 61C and a third drive signal Id3 to drive thecoil units 230-2 and 230-4 for movement in the third direction. Thedriver 62C of the second sensor 240 b may receive the output VH3 of theHall sensor 61B.

The description of the first position sensor 170 shown in FIG. 8B mayalso be applied to the first sensor 240 a and the second sensor 240 bshown in FIG. 16B, with or without modification.

For example, each of the first position sensor 170, the first sensor 240a and the second sensor 240 b may transmit and receive a clock signaland a data signal to and from the controller 830 or 780 through datacommunication using a protocol such as, for example, I2C communication.

The power signals VDD and VSS may be supplied to each of the firstposition sensor 170, the first sensor 240 a, and the second sensor 240 bthrough two terminals (for example, 21-2 and 21-2) of the circuit board250.

For example, the drivers 62A, 62B and 62C of the first position sensor170, the first sensor 240 a and the second sensor 240 b may beconductively connected to two terminals 21-1 and 21-2 of the circuitboard 250, and may receive the VDD signal and the VSS signal through thetwo terminals 21-1 and 21-2. For example, the voltage of the VDD signalmay be higher than the voltage of the VSS signal. For example, the VSSsignal may be a ground signal GND, and the voltage of the VSS signal maybe a ground voltage.

The clock signal SCL may be supplied to each of the first positionsensor 170, the first sensor 240 a, and the second sensor 240 b throughanother terminal (for example, 21-3) of the circuit board 250.

For example, the drivers 62A, 62B and 62C of the first position sensor170, the first sensor 240 a, and the second sensor 240 b may beconductively connected to another terminal (for example, 21-3) of thecircuit board 250, and may transmit and receive the clock signal SCLthrough the terminal 21-3.

The data signal SDA may be supplied to each of the first position sensor170, the first sensor 240 a, and the second sensor 240 b through anotherterminal (for example, 21-4) of the circuit board 250.

For example, the drivers 62A, 62B and 62C of the first position sensor170, the first sensor 240 a, and the second sensor 240 b may beconductively connected to another terminal (for example, 21-4) of thecircuit board 250, and may transmit and receive the data signal SDAthrough the terminal 21-4.

For example, the first position sensor 170, the first sensor 240 a andthe second sensor 240 b may have different addresses or identificationcodes, and the controller 830 or 780 may discriminate or identify thefirst position sensor 170, the first sensor 240 a and the second sensor240 b based on the different addresses and may transmit and receive thedata signal SDA to and from the first position sensor 170, the firstsensor 240 a and the second sensor 240 b depending on the result of theidentification.

Each of the first position sensor 170, the first sensor 240 a, and thesecond sensor 240 b may further include at least one test terminal fortesting, and the circuit board 250 may further include a terminal (forexample, 21-5), which is conductively connected to the test terminal.

In FIGS. 16A and 16B, since the first position sensor 170, the firstsensor 240 a, and the second sensor 240 b receive the power signals VDDand VSS through the two terminals 21-1 and 21-2 of the circuit board andtransmit and receive the clock signal SCL and the data signal SDA to andfrom the outside through two other terminals 21-3 and 21-4 of thecircuit board 250, it is possible to reduce the number of terminals ofthe circuit board 250 required for operation of the first positionsensor 170, the first sensor 240 a, and the second sensor 240 b.

FIG. 17A is a block diagram illustrating the supply of the power signalsVDD and VSS, the data signal SDA and the clock signal SCL to the firstposition sensor 170, the first sensor 240 a, and the second sensor 240 baccording to another embodiment. FIG. 17B is a circuit diagram of thefirst position sensor 170, the first sensor 240 a, and the second sensor240 b shown in FIG. 17A.

Referring to FIGS. 17A and 17B, each of the first position sensor 170,the first sensor 240 a and the second sensor 240 b may be of a driver ICtype.

The power signals VDD and VSS may be supplied to each of the firstposition sensor 170, the first sensor 240 a and the second sensor 240 bthrough two terminals (for example, 21-2 and 21-2) of the circuit board250.

For example, the power signals VDD and VSS may be supplied to each ofthe first position sensor 170, the first sensor 240 a, and the secondsensor 240 b through the first and second terminals 21-2 and 21-2 of thecircuit board 250.

Different clock and data signals may be supplied to each of the firstposition sensor 170, the first sensor 240 a, and the second sensor 240b.

For example, the drivers 62A, 62B and 62C of the first position sensor170, the first sensor 240 a, and the second sensor 240 b may beconductively connected to the first and second terminals 21-1 and 21-2of the circuit board 250, and the power signals VDD and VSS may besupplied through the first and second terminals 21-1 and 21-2.

For example, the driver 62A of the first position sensor 170 may beconductively connected to the third and fourth terminals 21-3 and 21-4of the circuit board 250, and a first clock signal SCL1 and a first datasignal SDA1 may be supplied through the third and fourth terminals 21-3and 21-4 of the circuit board 250.

For example, the driver 62B of the first sensor 240 a may beconductively connected to the fifth and sixth terminals 21-5 and 21-6 ofthe circuit board 250, and a second clock signal SCL2 and a second datasignal SDA2 may be supplied through the fifth and sixth terminals 21-5and 21-6 of the circuit board 250.

For example, the driver 62C of the second sensor 240 b may beconductively connected to the seventh and eighth terminals 21-7 and 21-8of the circuit board 250, and a third clock signal SCL3 and a third datasignal SDA3 may be supplied through the seventh and eighth terminals21-7 and 21-8 of the circuit board 250.

In FIGS. 17A and 17B, since the first position sensor 170, the firstsensor 240 a, and the second sensor 240 b receive the power signals VDDand VSS through the two terminals 21-1 and 21-2, it is possible toreduce the number of circuit boards 250 required to drive the firstsensor 170, the first sensor 240 a, and the second sensor 240 b.

FIG. 18 is a block diagram illustrating the supply of the power signalsVDD and VSS, the data signal SDA and the clock signal SCL of the firstposition sensor 170, the first sensor 240 a and the second sensor 240 baccording to another embodiment.

Referring to FIG. 18, the circuit board 250 may further include aterminal providing a frame ground (GND). The frame ground of the circuitboard 250 may be conductively connected to the cover member 300. Forexample, the terminal of the circuit board 250, which supplies the VSSsignal, may be conductively connected to the frame ground.

The description disclosed in connection with FIGS. 16A and 16B may alsobe applied to the embodiment shown in FIG. 18, with or withoutmodification, except for the description of the test terminal in FIGS.16A and 16B.

FIG. 19 illustrates magnets 1130-1 to 1130-4, second coils 1230-1 to1230-4, the first sensor 240 a, and the second sensor 240 b according toanother embodiment.

In the embodiment shown in FIGS. 1 to 15, the magnets 130-1 to 130-4 maybe disposed at the corner portions of the housing 140, the coil units230-1 to 230-4 of the second coil 230 may be disposed so as to face themagnets 130-1 to 130-4, and the first and second sensors 240 a and 240 bmay be disposed inside the coil units 230-1 and 230-2.

Meanwhile, referring to FIG. 19, the magnets 1130-1 to 1130-4 may bedisposed at the side portions of the housing 140. The coil units 1230-1to 1230-4 may be disposed in the region between the sides of the uppersurface of the circuit board 1250 and the bore 1205 in the circuit board1250 so as to face the magnets 1130-1 to 1130-4 in the optical-axisdirection.

Each of the coil units 1230-1 to 1230-4 may be disposed adjacent to acorresponding one of the sides of the upper surface of the circuit board250, and the longitudinal direction of each of the coil units 1230-1 to1230-4 may be parallel to a corresponding one of the sides of thecircuit board 250.

The first coil unit 1230-1 and the third coil unit 1230-3 may bedisposed adjacent to two sides of the circuit board 250, which face eachother, and the second coil unit 1230-2 and the fourth coil unit 1230-4may be disposed adjacent to the two other sides of the circuit board250, which face each other.

For example, the first sensor 240 a may be disposed adjacent to a firstend of the first coil unit 1230-1. For example, the second sensor 240 bmay be disposed adjacent to a second end of the second coil unit 1230-2,which is positioned opposite a first end of the second coil unit 1230-2,adjacent to the first end of the first coil unit 1230-1.

For example, the first sensor 240 a may not overlap the first coil unit1230-1 in the optical-axis direction, and the second sensor 240 b maynot overlap the second coil unit 1230-2 in the optical-axis direction.The reason for this is because the first and second sensors 240 a and240 b may not precisely detect variation of magnetic force generatedfrom the magnet due to noise caused by the magnetic force generated fromthe coil units 1230-1 and 1230-2 when the first and second sensors 240 aand 240 b overlap the coil units 1230-1 and 1230-2 in the optical-axisdirection. However, the sensors and the coil units may overlap eachother in the optical-axis direction in another embodiment.

For example, the crosswise length BL1 of the first coil unit 1230-1 maybe less than the crosswise length BL2 of the third coil unit 1230-3, andthe crosswise length BL1 of the second coil unit 1230-2 may be less thanthe crosswise length BL2 of the fourth coil unit 1230-4.

Each of the magnets 1130-1 and 1130-2 may include a portion that doesnot overlap a corresponding one of the coil units 1230-1 and 1230-2.

For example, one end of the first magnet 1130-1 may not overlap thefirst coil unit 1130-1 in the optical-axis direction. The one end of thefirst magnet 1130-1, which does not overlap the first coil unit 1130-1,may overlap the first sensor 240 a in the optical-axis direction.

For example, a second end of the second magnet 1130-2, which ispositioned opposite a first end of the second magnet 1130-2, adjacent toa first end of the first magnet 1130-1, may not overlap the second coilunit 1130-2. The second end of the second magnet 1130-2, which does notoverlap the second coil unit 1130-2, may overlap the second sensor 240 bin the optical-axis direction.

For example, when viewed from above, the third magnet 1130-3 may bedisposed in the third coil unit 1230-3, and the fourth magnet 1130-4 maybe disposed in the fourth coil unit 1230-4.

For example, the crosswise length of the third magnet 1130-3 may be lessthan the crosswise length BL2 of the third coil unit 1230-3, and thecrosswise length BL3 of the fourth magnet 1130-4 may be less than thecrosswise length BL2 of the fourth coil unit 1230-4.

For example, although the crosswise lengths of the first to fourthmagnets 1130-1 to 1130-4 may be the same, the disclosure is not limitedthereto.

For example, in another embodiment, the crosswise length of the firstmagnet 1130-1 may be less than the crosswise length of the third magnet1130-3, and the crosswise length of the second magnet 1130-2 may be lessthan the crosswise length of the fourth magnet 1130-4. Furthermore, thecrosswise length of the first magnet 1130-1 and the crosswise length ofthe second magnet 1130-2 may be the same, and the crosswise length ofthe third magnet 1130-2 and the crosswise length of the fourth magnet1130-4 may be the same.

Although not illustrated in FIG. 19, the circuit board 1250 may includeeight pads, which correspond to the first to eighth pads PX1 to PX4 andPY1 to PY4 described in connection with FIGS. 12A, 12B, 13 and 14, andthe first to fourth coil units 1230-1 to 1230-4 may be conductivelyconnected to the eight pads of the circuit board 1250. Here, the firstcoil unit 1230-1 and the second coil unit 1230-2 may be connected toeach other in series via the eight pads of the circuit board 1250, andthe second coil unit 1230-2 and the fourth coil unit 1230-4 may beconnected to each other in series.

The description disclosed in connection with FIGS. 16A to 18 may also beapplied to the embodiment shown in FIG. 19, with or withoutmodification.

Although the power signals VDD and VSS may be supplied to each of thefirst position sensor 170, the first sensor 240 a and the second sensor240 b through the two terminals 21-1 and 21-2 of the circuit board 250in the embodiment shown in FIGS. 16A to 18, the disclosure is notlimited thereto. In another embodiment, the circuit board 250 mayinclude two terminals for supplying a first power signal to the firstposition sensor 170, two other terminals for supplying a second powersignal to the first sensor 240 a, and two other terminals for supplyinga third power signal to the second sensor 240 b. Here, although each ofthe first to third power signals may include the power signal VSS andthe power signal VDD, the disclosure is not limited thereto. In anotherembodiment, at least one of the first to third power signals may includea different power signal.

FIG. 20 is an exploded perspective view illustrating a camera module 200according to an embodiment.

Referring to FIG. 20, the camera module may include a lens barrel 400,the lens moving apparatus 100, an adhesive member 710, a filter 610, afirst holder 600, a second holder 800, an image sensor 810, a motionsensor 820, a controller 830 and a connector 840.

The lens barrel 400 may be mounted in the bobbin 110 of the lens movingapparatus 100 or 1000.

The first holder 600 may be disposed under the base 210 of the lensmoving apparatus 100. The filter 610 may be mounted on the first holder600, and the first holder 600 may include a projection 500 on which thefilter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lensmoving apparatus 100 to the first holder 600. In addition to theattachment function described above, the adhesive member 612 may serveto inhibit contaminants from entering the lens moving apparatus 100.

For example, the adhesive member 612 may be, for example, epoxy,thermohardening adhesive, or ultraviolet hardening adhesive.

The filter 610 may serve to inhibit light within a specific frequencyband that passes through the lens barrel 400 from being introduced intothe image sensor 810. The filter 610 may be, for example, aninfrared-light-blocking filter, without being limited thereto. Here, thefilter 610 may be oriented parallel to the X-Y plane.

The region of the first holder 600 in which the filter 610 is mountedmay be provided with a bore in order to allow the light that passesthrough the filter 610 to be introduced into the image sensor 810.

The second holder 800 may be disposed under the first holder 600, andthe image sensor 810 may be mounted on the second holder 600. The imagesensor 810 may be the region, on which an image included in the lightthat passes through the filter 610 and is incident thereon is formed.

The second holder 800 may include, for example, various circuits,devices, and a controller in order to convert the image, formed on theimage sensor 810, into electrical signals and to transmit the electricalsignals to an external component.

The second holder 800 may be embodied as a circuit board on which theimage sensor 810 may be mounted, on which a circuit pattern may beformed, and to which various devices may be coupled. The first holder600 may be alternatively referred to as a “holder” or a “sensor base”,and the second holder 800 may be alternatively referred to as a “board”or a “circuit board”.

The image sensor 810 may receive an image included in the lightintroduced through the lens moving apparatus 100, and may convert thereceived image into an electrical signal.

The filter 610 and the image sensor 810 may be disposed so as to bespaced apart from each other in the state of facing each other in thefirst direction.

The motion sensor 820 may be mounted on the second holder 800, and maybe conductively connected to the controller 830 through the circuitpattern formed on the second holder 800.

The motion sensor 820 may output information about a rotational angularspeed caused by motion of the camera module 200. The motion sensor 820may be embodied as a dual-axis or triple-axis gyro sensor or an angularspeed sensor.

The controller 830 may be mounted on the second holder 800, and may beconductively connected to the second position sensor 240 of the lensmoving apparatus 100 and the second coil 230. For example, the secondholder 800 may be conductively connected to the circuit board 250 of thelens moving apparatus 100, and the controller 830 mounted on the secondholder 800 may be conductively connected to the second position sensor240 and the second coil 230 via the circuit board 250.

The controller 830 may transmit the clock signal SCL, the data signalSDA and the power signals VDD and GND for I2C communication with thefirst and second position sensors 170 and 240, and may receive the clocksignal SCL and the data signal SDA from the first and second positionsensors 170 and 240.

The controller 830 may perform a feedback autofocusing operation for theAF operation unit of the lens moving apparatus based on the outputsupplied from the first position sensor 170.

Furthermore, the controller 830 may perform handshake correction for theOIS operation unit of the lens moving apparatus 100 based on the signalsoutput from the second position sensor 240.

The connector 840 may be conductively connected to the second holder800, and may have therein a port that is intended to be conductivelyconnected to an external device.

FIG. 21 is a perspective view of a camera device 1010A according toanother embodiment. FIG. 22 is an exploded perspective view of thecamera device 1010A shown in FIG. 21. FIG. 23 is an exploded perspectiveview of a lens moving apparatus according to an embodiment. FIG. 24 is aperspective view of some components of the camera device 1010A accordingto the embodiment. FIG. 25 is a cross-sectional view taken along lineA-A in FIG. 24. FIG. 26 is a cross-sectional view taken along line B-Bin FIG. 24. FIG. 27 is a cross-sectional view taken along line C-C inFIG. 24. FIG. 28 is an exploded perspective view of some components ofthe camera device 1010A according to the embodiment. FIG. 29 is anexploded bottom perspective view of some components of the camera device101A according to the embodiment. FIG. 30 is a cross-sectional view ofsome components of the camera device 1010A according to a modification.

The camera device 1010A may include a camera module.

The camera device 1010A may include a lens moving apparatus 1010. Thelens moving apparatus may be a voice coil motor (VCM). The lens movingapparatus may be a lens moving motor. The lens moving apparatus may be adriving actuator. The lens moving apparatus may include an AF module.The lens moving apparatus may include an OIS module.

For example, the lens moving apparatus 1010 may be the lens movingapparatus 100 according to the embodiment described in connection withFIGS. 1 to 19, and the description of the lens moving apparatus 100shown in FIGS. 1 to 19 may also be applied to the camera device 1010Ashown in FIGS. 21 to 30. Furthermore, the description of the motionsensor 820 and the controller 830 shown in FIG. 20 may also be appliedto the camera device 1010A shown in FIGS. 21 to 30, with or withoutmodification.

The lens moving apparatus 1010 may include a stationary unit 1100. Thestationary unit 1100 may be a unit to which a component or components,which do not move relative to an operation unit 1200 during an AFoperation of the camera device 1010A, are coupled. The stationary unit1100 may include a housing 1110 and magnets 1120. Here, a base 1400 anda cover 1500 may also be considered as the stationary unit 1100. Thedescription of the stationary unit 1100 and the operation unit 1200 mayalso be applied to the lens moving apparatus 100 shown in FIG. 1.

The lens moving apparatus 1010 may include the housing 1110. The housing1110 may be disposed outside a bobbin 1210. The housing 1110 mayaccommodate therein at least a portion of the bobbin 1210. The housing1110 may be disposed in the cover 1500. The housing 1110 may be disposedbetween the cover 1500 and the bobbin 1210.

The housing 1110 may be made of a material different from that of thecover 1500. The housing 1110 may be made of an insulation material. Thehousing 1110 may be manufactured through injection molding.

The magnet 1120 may be disposed at the housing 1110. The housing 1110may be coupled to the magnets 1120 using an adhesive. An upper elasticmember 1310 may be coupled to the upper portion of the housing 1110. Alower elastic member 1320 may be coupled to the lower portion of thehousing 1110. The housing 1110 may be coupled to the elastic member 1300using heat fusion and/or an adhesive. The adhesive used to couple thehousing 1110, the magnets 1120, the housing 1110 and the elastic member1300 may be epoxy, which is hardened by at least one of ultraviolet(UV), heat and laser.

The lens moving apparatus 1010 may include the magnets 1120. The magnets1120 may be disposed at the housing 1110. The magnets 1120 may bedisposed between the bobbin 1210 and the housing 1110. The magnets 1120may be disposed between the bobbin 1210 and the side plate 1520 of thecover 1500. The magnets 1120 may be disposed between a coil 1220 and theside plate 1520 of the cover 1500.

The magnets 1120 may face the coil 1220. The magnet 1120s mayelectromagnetically interact with the coil 1220. Each of the magnets1120 may be disposed at the side portion between two adjacent cornerportions of the housing 1110. Here, each of the magnets 1120 may be aflat plate magnet having the shape of a flat plate. In a modification,the magnets 1120 may be disposed at the corner portions of the housing1110. Here, each of the magnets 1120 may be a corner magnet having ahexahedral form, in which the inner surface thereof is larger than theouter surface thereof.

The magnets 1120 may include a plurality of magnets. The magnets 1120may include a total of four magnets. The magnets 1120 may include firstto fourth magnets.

The lens moving apparatus 1010 may include the operation unit 1200. Theoperation unit 1200 may be a unit to which a component or components,which are moved relative to the stationary unit 1100, are coupled. Theoperation unit 1200 may include the bobbin 1210 and the coil 1220.

The lens moving apparatus 1010 may include the bobbin 1210. The bobbin1210 may be disposed in the housing 1110. The bobbin 1210 may bedisposed in the bore in the housing 1110. The bobbin 1110 may be movablycoupled to the housing 1110. The bobbin 1210 may be moved relative tothe housing 1110 in the optical-axis direction.

A lens may be coupled to the bobbin 1210. The lens may be coupled to thebobbin 1210 using threaded coupling and/or an adhesive. The coil 1220may be coupled to the bobbin 1210. The upper elastic member 1310 may becoupled to the upper portion of the bobbin 1210. The lower elasticmember 1320 may be coupled to the lower portion of the bobbin 1210. Thebobbin 1210 may be coupled to the elastic member 1300 using heat fusionand/or an adhesive. The adhesive used to couple the lens to the bobbin1210 and the bobbin 1210 to the elastic member 1300 may be epoxy, whichis hardened by at least one of ultraviolet (UV), heat and laser.

The lens moving apparatus 1010 may include the coil 1220. The coil 1220may be an “AF driving coil”, which is used for AF operation. The coil1220 may be disposed at the bobbin 1210. The coil 1220 may be disposedbetween the bobbin 1210 and the housing 1110. The coil 1220 may bedisposed between the bobbin 1210 and the side plate 1520 of the cover1500. The coil 1220 may be disposed on the outer lateral surface or theouter peripheral surface of the bobbin 1210.

The coil 1220 may be directly wound around the bobbin 1210.Alternatively, the coil 1220 may be coupled to the bobbin 1210 in thestate of being wound alone. The coil 1220 may face the magnets 1120. Thecoil 1220 may be disposed so as to face the magnets 1120. The coil 1220may electromagnetically interact with the magnets 1120. Here, whencurrent flows through the coil 1220 and thus an electromagnetic field isformed around the coil 1220, the coil 1220 may be moved relative to themagnets 1120 by the electromagnetic interaction between the coil 1220and the magnets 1120. The coil 1220 may be composed of a single coil. Ina modification, the coil 1220 may include a plurality of coils, whichare spaced apart from each other.

The coil 1220 may include a pair of lead wires for supplying power.Here, one end (a lead wire) of the coil 1220 may be connected to a firstlower elastic unit, and the other end (the lead wire) of the coil 1220may be connected to a second lower elastic unit. In other words, thecoil 1220 may be conductively connected to the lower elastic member1320.

The coil 1220 and the bobbin 1210 may be moved upwards along the opticalaxis when forward current is applied to the coil 1220, and may be moveddownwards along the optical axis when reverse current is applied to thecoil 1220. At the initial position, at which current is not applied tothe coil 1220, the bobbin 1210 may be spaced apart from the upper plate1510 of the cover 1500 with a first gap therebetween and from the base1400 with a second gap therebetween.

The bobbin 1210 may be moved in the direction in which the first gapdecreases when forward current is applied to the coil 1220, and thebobbin 1210 may be moved in the direction in which the second gapdecreases when reverse current is applied to the coil 1220.

The lens moving apparatus 1010 may include the elastic member 1300. Theelastic member 1300 may connect the housing 1110 to the bobbin 1210. Theelastic member 1300 may be coupled both to the housing 1110 and to thebobbin 1210. The elastic member 1300 may movably support the bobbin1210. The elastic member 1300 may elastically support the bobbin 1210.At least a portion of the elastic member 1300 may exhibit elasticity.The elastic member 1300 may support the movement of the bobbin 1210during AF operation. Here, the elastic member 1300 may be an “AF supportmember”.

The elastic member 1300 may include the upper elastic member 1310. Theupper elastic member 1310 may be coupled both to the upper portion ofthe bobbin 1210 and to the upper portion of the housing 1110. The upperelastic member 1310 may be coupled to the upper surface of the bobbin1210. The upper elastic member 1310 may be coupled to the upper surfaceof the housing 1110. The upper elastic member 1310 may be embodied as aleaf spring.

The upper elastic member 1310 may include an outer portion, which iscoupled to the upper portion of the housing 1110. The upper elasticmember 1310 may include an inner portion, which is coupled to the upperportion of the bobbin 1210. The upper elastic member 1310 may include aconnector, connecting the outer portion to the inner portion. Theconnector may exhibit elasticity. Here, the connector may be referred toas an “elastic portion”. The connector may be bent twice or more.

The elastic member 1300 may include the lower elastic member 1320. Thelower elastic member 1320 may be coupled both to the lower portion ofthe bobbin 1210 and to the lower portion of the housing 1110. The lowerelastic member 1320 may be coupled to the lower surface of the bobbin1210. The lower elastic member 1320 may be coupled to the lower surfaceof the housing 1110. The lower elastic member 1320 may be embodied as aleaf spring.

The lower elastic member 1320 may include first and second lower elasticunits. The first and second lower elastic units may be spaced apart fromeach other. The first and second lower elastic units may be conductivelyconnected to the coil 1220. The first and second lower elastic units maybe used as conductive lines for applying current to the coil 1220.

The lower elastic member 1320 may include an outer portion, which iscoupled to the lower portion of the housing 1110. The lower elasticmember 1320 may include an inner portion, which is coupled to the lowerportion of the bobbin 1210. The lower elastic member 1320 may include aconnector connecting the outer portion to the inner portion. Theconnector may exhibit elasticity. Here, the connector may be referred toas an “elastic portion”. The connector may be bent twice or more. Thelower elastic member 1320 may include a terminal member. The terminalmember may extend from the outer portion. The terminal member may beintegrally formed with the outer portion, and may be bent and thenextend downwards. In a modification, the terminal member may be formedseparately from the lower elastic member 1320. The terminal member mayinclude two terminals. The terminal member may be coupled to theterminal of a printed circuit board 1050 through soldering.

The lens moving apparatus 1010 may include the base 1400. The base 1400may be disposed under the housing 1110. The base 1400 may be disposedunder the bobbin 1210. At least a portion of the base 1400 may be spacedapart from the bobbin 1210. The base 1400 may be coupled to the sideplate 1520 of the cover 1500.

The lens moving apparatus 1010 may include the cover 1500. The cover1500 may include a “cover can”. The cover 1500 may be disposed so as tosurround the housing 1110. The cover 1500 may be coupled to the base1400. The cover 1500 may be accommodated in the housing 1110. The cover1500 may define the appearance of the lens moving apparatus 1010. Thecover 1500 may have a hexahedral form, which is open at the lowersurface thereof. The cover 1500 may be nonmagnetic. The cover 1500 maybe made of metal. The cover 1500 may be made of a metal plate. The cover1500 may be connected to the ground portion of the printed circuitboard. Consequently, the cover 1500 may be grounded. The cover 1500 mayblock electromagnetic interface (EMI). Here, the cover 150 may bereferred to as an “EMI shield can”.

The cover 1500 may include the upper plate 1510 and the side plate 1520.The cover 1500 may include the upper plate 1510, having the boretherein, and the side plate 1520, extending downwards from the outerperiphery or the edge of the upper plate 1510. The lower end of the sideplate 1520 of the cover 1500 may be disposed at a stepped portion of thebase 1400. The inner surface of the side plate 1520 of the cover 1500may be fixed to the base 1400 using an adhesive.

The side plate 1520 of the cover 1500 may include a plurality of sideplates. The plurality of side plates may include first to fourth sideplates. The side plates 1520 of the cover 1500 may include the first andsecond side plates, which are disposed opposite each other, and thethird and fourth side plates, which are disposed opposite each otherbetween the first and second side plates.

The camera device 1010A may include a lens module 1020. The lens module1020 may include at least one lens. The lens module 1020 may include aplurality of lenses. The lens may be spaced apart from an image sensor1060. The lens may be disposed at a position corresponding to the imagesensor 1060. The lens may be disposed above the image sensor 1060. Thelens module 1020 may include the lens and a barrel. The lens module 1020may be coupled to the bobbin 1210 of the lens moving apparatus 1010. Thelens module 1020 may be coupled to the bobbin 1210 using threadedcoupling and/or an adhesive. The lens module 1020 may move together withthe bobbin 1210.

The camera device 1010A may include a filter 1030. The filter 1030 mayserve to inhibit a specific frequency band of light, which passesthrough the lens module 1020, from entering the image sensor 1060. Thefilter 1030 may include an infrared filter. The infrared filter mayinhibit light of an infrared band from entering the image sensor 1060.The filter 1030 may be disposed so as to be parallel to the x-y plane.The filter 1030 may be disposed between the image sensor 1060 and thelens. The filter 1030 may be disposed at a sensor base 1070. The filter1030 may be coupled to the sensor base 1070. In a modification, thefilter 1030 may also be disposed at the base 1400.

The upper surface of the filter 1030 may include a first region 1032between a light-blocking member 1031 and the outer periphery of theupper surface of the filter 1030. The first region 1032 may be a regioncorresponding to the gap between the light-blocking member 1031 and theouter edge of the filter 1030. An adhesive may be disposed in the firstregion 1032. The first region 1032 may be a portion of the upper surfaceof the filter 1030. In a modification, the first region 1032 may be aportion of the lower surface of the filter 1030. The first region 1032may be a portion of the upper surface and a portion of the lower surfaceof the filter 1030. The first region 1032 may be a portion of onesurface of the filter 1030.

The camera device 1010A may include the light-blocking member 1031. Thelight-blocking member 1031 may be considered a component of the filter1030. The light-blocking member 1031 may have light-blocking ability.The light-blocking member 1031 may be made of black ink. Thelight-blocking member 1031 may include a black mask. The light-blockingmember 1031 may be disposed on at least a portion of the upper surfaceof the filter 1030. In a modification, the light-blocking member 1031may be disposed on at least a portion of the lower surface of the filter1030. The light-blocking member 1031 may be disposed both on the uppersurface and on the lower surface of the filter 1030. The light-blockingmember 1031 may be disposed on one surface of the filter 1030.

The light-blocking member 1031 may be spaced apart from the outerperiphery of the upper surface of the filter 1030. The black mask may bespaced apart from the outer periphery of the upper surface of the filter1030. In other words, a gap may be defined between the light-blockingmember 1031 and the outer periphery of the filter 1030. For example, thefilter 1030 may be manufactured in such a way as to form thelight-blocking member 1031 and then to cut the light-blocking member1031 into individual filters 1030. Here, if the light-blocking member1031 is formed up to the outer periphery of the filter 1030, thelight-blocking member 1031 may break during the cutting procedure.Meanwhile, when the light-blocking member 1031 is intended to be formedup to the outer periphery of the filter 1030 in the case in whichindividual filters 1030 are prepared through cutting in advance and thelight-blocking members 1031 are formed at the filters 1030, there is aproblem in that it becomes impossible to inhibit a phenomenon in whichthe light-blocking member 1031, which is made of flowable ink, flowsdownwards along the side surface of the filter 1030 during the processof applying the light-blocking member. The light-blocking member 1031may be spaced apart from both the longer sides and the shorter sides ofthe upper surface of the filter 1030 by the same distance. In amodification, the light-blocking member 1031 may be spaced apart fromthe longer sides of the upper surface of the filter 1030 by a distancelonger than the distance from the shorter sides of the upper surface ofthe filter 1030. In contrast, the light-blocking member 1031 may bespaced apart from the shorter sides of the upper surface of the filter1030 by a distance longer than the distance from the longer sides of theupper surface of the filter 1030.

The camera device 1010A may include an adhesive 1040. The camera device1010A may include a light-blocking adhesive 1040. The adhesive 1040 mayattach the filter 1030 to the sensor base 1070. The adhesive 1040 mayhave a light-blocking property. The adhesive 1040 may include blackepoxy. The light-blocking adhesive 1040 may include at least one ofblack resin, black adhesive, and light-blocking adhesive. The adhesive1040 may be disposed between the side surface of the filter 1030 and thesensor base 1070. The adhesive 1040 may be disposed in the first region1032 on the upper surface of the filter 1030. At least a portion of theadhesive 1040 may be disposed in the first region 1032 of the filter1030. Light-blocking epoxy may be disposed in the first region 1032 ofthe upper surface of the filter between the black mask and the outerperiphery of the upper surface of the filter 1030. The adhesive 1040 maybe connected to the light-blocking member 1031. The adhesive 1040 mayproject above the upper surface of the filter 1030. The adhesive 1040may project upwards further than the upper surface of the filter 1030.The adhesive 1040 may be disposed on the upper surface and the sidesurface of the filter 1030.

In the embodiment, the adhesive 1040 may be disposed at the entireperiphery of the filter 1030. The adhesive 1040 may be disposed alongthe entire periphery of the filter 1030. The adhesive 1040 may becontinuously disposed along the outer periphery of the filter 1030. In amodification, the adhesive 1040 may be intermittently disposed along theouter periphery of the filter 1030. For example, the adhesive 1040 maybe disposed only at the side portions of the filter 1030, but not at thecorner portions of the filter 1030. That is, the adhesive may not bedisposed at the four corners of the filter 1030 but may be disposed onlyat the four sides of the filter 1030. Here, the adhesive 1040 may becontinuously disposed at the four side walls of the filter 1030, or maybe divided into a plurality of adhesives, which are disposed so as to bespaced apart from each other.

In a further modification, the adhesive 1040 may be disposed only at oneside of the filter 1030. Alternatively, the adhesive 1040 may bedisposed both on one side of the filter 1030 and on another side of thefilter 1030, which is positioned opposite the one side of the filter1030. The adhesive 1040 may be disposed only at the corners of thefilter 1030.

In the embodiment, the adhesive 1040 may cover at least a portion of thelight-blocking member 1031 such that the adhesive 1040 overlaps thelight-blocking member 1031 in a direction parallel to the optical axis.The adhesive 1040, the light-blocking member 1031, the filter 1030, andthe sensor base 1070 may be sequentially disposed in a directionparallel to the optical axis.

The adhesive 1040 may include first to third portions 1041, 1042 and1043. The first portion 1041 may be disposed on a side surface of thefilter 1030. The second portion 1042 may be disposed in the first regionon the upper surface of the filter 1030. The third portion 1043 mayconnect the first portion 1041 to the second portion 1042. Although theadhesive 1040 has been described as being divided into the first tothird portions 1041, 1042 and 1043, the adhesive 1040 may be integrallyformed.

The embodiment may aim to inhibit flare by blocking light incidentthrough a side surface of the filter 1030. In a comparative example,light that has passed through the lens may collide with the innersurface of the sensor base 1070, which faces the side surface of thefilter 1030, and may then pass through the side surface of the filter1030. Subsequently, the light may be reflected by the bottom surface ofthe sensor base 1070, on which the lower surface of the filter 1030 isdisposed, and by the light-blocking member 1031, and may enter the imagesensor 1060. Hence, flaring may occur. In other words, in thecomparative example, the light may be reflected by the light-blockingmember 1031 of the filter 1030 and may then enter the image sensor 1060,thereby causing the occurrence of flaring. In the embodiment, blackepoxy may be applied to the outer periphery of the filter 1030 so as toblock the light that is incident through the side surface of the filter1030. Here, the black epoxy may cover the entire gap between the blackmask and the outer periphery of the filter 1030. The epoxy is an exampleof the adhesive 1040. The adhesive 1040 may cover the entire sidesurface of the filter 1030. In order to inhibit interference with thelens, the height of the adhesive 1040 may be controlled to be 40 μm orless.

In the embodiment, since the outer periphery of the filter 1030 iscovered by the adhesive 1040, it is possible to reduce the transmissionof contaminants to the filter 1030. In other words, the adhesive 1040may block the introduction of contaminants into the filter 1030. Theadhesive 1040 may be viscous. The adhesive 1040 may collect contaminantsby virtue of the high viscosity thereof. In other words, the adhesive1040 may serve as a dust trap. Accordingly, the embodiment is able toobtain an effect of reducing the incidence of spots on an image.

In the embodiment, the adhesive 1040 may be disposed only on the sidesurface and the upper surface of the filter 1030. In other words, theadhesive 1040 may not be disposed on the lower surface of the filter1030. When an excessive amount of adhesive 1040 is applied to the bottomsurface of the sensor base 1070 in order to dispose the adhesive 1040between the lower surface of the filter 1030 and the sensor base 1070,the adhesive 1040 may penetrate into the filter 1030 due to thefollowability of the adhesive 1040. In a modification, the adhesive 1040may also be disposed on the lower surface of the filter 1030.

The camera device 1010A may include the printed circuit board (PCB)1050. The printed circuit board 1050 may be a board or a circuit board.The lens moving apparatus 1010 may be disposed at the printed circuitboard 1050. In a modification, the sensor base may be disposed betweenthe printed circuit board 1050 and the lens moving apparatus 1010. Theprinted circuit board 1050 may be conductively connected to the lensmoving apparatus 1010. The terminal member of the lower elastic member1320 of the lens moving apparatus 1010 may be soldered to the printedcircuit board 1050. The image sensor 1060 may be disposed at the printedcircuit board 1050. The printed circuit board 1050 may be provided withvarious circuits, devices, controllers and the like, which areconfigured to convert an image formed on the image sensor 1060 into anelectric signal and transmit the converted electric signal to anexternal device.

The camera device 1010A may include a connector 1051. The connector 1051may be conductively connected to the printed circuit board 1050. Theconnector 1051 may include a port, which is to be conductively connectedto an external device. The connector 1051 may be connected to theprinted circuit board 1050 via the connecting board 1052. The connectingboard 1052 may include a flexible printed circuit board (FPCB).

The camera device 1010A may include the image sensor 1060. Light thathas passed through the lens and the filter 1030 may be incident on theimage sensor 1060, thereby forming an image on the image sensor. Theimage sensor 1060 may be disposed at the printed circuit board 1050. Theimage sensor 1060 may be mounted on the printed circuit board 1050. Theimage sensor 1060 may be conductively connected to the printed circuitboard 1050.

For example, the image sensor 1060 may be coupled to the printed circuitboard 1050 using Surface-Mounting Technology (SMT). Alternatively, theimage sensor 1060 may be coupled to the printed circuit board 1050 usingflip-chip technology.

The image sensor 1060 may be disposed such that the lens coincides withthe optical axis. In other words, the optical axis of the image sensor1060 may be aligned with the optical axis of the lens. The image sensor1060 may convert light, incident on the effective image region of theimage sensor 1060, into an electric signal. The image sensor 1060 may beany one of a charge-coupled device (CCD), a metal oxide semiconductor(MOS), a CPD and a CID.

The camera device 1010A may include the sensor base 1070. The sensorbase 1070 may be disposed at the printed circuit board 1050. The sensorbase 1070 may be disposed between the lens moving apparatus 1010 and theprinted circuit board 1050. The sensor base 1070 may be provided withthe filter 1030. The portion of the sensor base 1070, at which thefilter 1030 is disposed, may have formed therethrough a bore 1073 so asto allow the light having passed through the filter 1030 to be incidenton the image sensor 1060.

The upper surface of the sensor base 1070 may include a first surface1071, on which the lower surface of the filter 1030 is disposed. Theupper surface of the sensor base 1070 may include a second surface 1072,which is disposed outside the first surface 1071 and at a higher levelthan the first surface 1071. Here, the upper surface of the filter 1030may be disposed at a lower level than the second surface 1072 of thesensor base 1070. The adhesive 1040 may be disposed at the same level asthe second surface 1072 of the sensor base 1070, or may project furtherthan the second surface 1072 of the sensor base 1070. In a modification,the upper surface of the filter 1030 may be disposed at the same levelas the second surface 1072 of the sensor base 1070. The upper surface ofthe filter 1030 may be disposed at a higher level than the secondsurface 1072 of the sensor base 1070.

The sensor base 1070 may include a first groove 1074. The first groove1074 may be a filter-seating groove. The filter 1030 may be disposed inthe first groove 1074. The first groove 1074 may be configured to have ashape corresponding to the filter 1030. The first groove 1074 may bedeeper than a second groove 1075. In a modification, the bottom surfaceof the first groove 1074 may be positioned at a higher level than thebottom surface of the second groove 1075.

The sensor base 1070 may include the second groove 1075. The secondgroove 1075 may be a side groove, which is formed beside the firstgroove 1074. The second groove 1075 may be configured so as to have acurvature at at least a portion thereof. The second groove 1075 may bedisposed outside the first groove 1074. The second groove 1075 may bedepressed to a depth less than that of the first groove 1074.Consequently, the upper surface of the sensor base 1070 and the bottomsurface of the second groove 1075 may define a step therebetween, andthe bottom surface of the second groove 1075 and the bottom surface ofthe first groove 1074 may define a step therebetween. In other words,the upper surface of the sensor base 1070 may include a two-steppedstructure. The second groove 1075 may include a plurality of grooves.The second grooves 1075 may be formed at positions corresponding to thefour side surfaces of the first groove 1074.

The sensor base 1070 may include a third groove 1076. The third groove1076 may be a corner groove formed in a corner of the first groove 1074.The third groove 1076 may be configured so as to have a curvature at atleast a portion thereof. The third groove 1076 may be formed in a cornerof the first groove 1074. The third groove 1076 may be depressed to thesame depth as the first groove 1074. The adhesive 1040 may be disposedin the third groove 1076. The adhesive 1040 may be injected through thethird groove 1076. The third groove 1076 may include a plurality ofgrooves. The third grooves 1076 may be respectively formed in the fourcorners of the first groove 1074.

The sensor base 1070 may include a protrusion 1077. The protrusion 1077may be formed between the first groove 1074 and the second groove 1075.The protrusion 1077 may project further than the upper surface of thesensor base 1070. The protrusion 1077 may be disposed at a positioncorresponding to the longer side of the image sensor 1060. Theprotrusion 1077 may include a plurality of protrusions. The protrusion1077 may include two protrusions. Here, the image sensor 1060 may bedisposed between the two protrusions. The upper surfaces of theprotrusions 1077 may be positioned at a higher level than the uppersurface of the image sensor 1060.

The sensor base 1070 may include a fourth groove 1078. The fourth groove1078 may be an escape groove. The fourth groove 1078 may be formed inthe outer lateral surface of the sensor base 1070. The fourth groove1078 may be a groove through which the terminal member of the lowerelastic member 1320 extends without interference. The fourth groove 1078may include two grooves corresponding to two terminal members of thelower elastic member 1320.

The sensor base 1070 may include a fifth groove 1079. The fifth groove1079 may be a lower groove formed in the lower surface of the sensorbase 1070. The fifth groove 1079 may be formed in the lower surface ofthe sensor base 1070. A space may be defined between the sensor base1070 and the printed circuit board 1050 by virtue of the fifth groove1079. Components such as the image sensor 1060 and the capacitor may bedisposed in the space defined between the sensor base 1070 and theprinted circuit board 1050.

The camera device 1010A may include a first adhesive 1081. The firstadhesive 1081 may fix the lens moving apparatus 1010 to the sensor base1070. The first adhesive 1081 may include at least one of epoxy,thermohardening adhesive, and ultraviolet-hardening adhesive. The firstadhesive 1081 may be used in alignment of the image sensor 1060 with thelens coupled to the lens moving apparatus 1010. Specifically, the firstadhesive 1081 may be used for active alignment (AA).

The camera device 1010A may include a second adhesive 1082. The secondadhesive 1082 may fix the sensor base 1070 to the printed circuit board1050. The second adhesive may include at least one of epoxy,thermohardening adhesive, and ultraviolet-hardening adhesive.

The camera device 1010A may include motion sensor. The motion sensor maybe mounted on the printed circuit board 1050. The motion sensor may beconductively connected to the controller through the circuit patternformed on the printed circuit board 1050. The motion sensor may outputinformation about a rotational angular speed of motion of the cameradevice 1010A. The motion sensor may include a dual-axis or triple-axisgyro sensor or an angular speed sensor.

The camera device 1010A may include the controller. The controller maybe disposed on the printed circuit board 1050. The controller may beconductively connected to the coil 1220 of the lens moving apparatus1010. The controller may individually control the direction, theintensity, the amplitude and the like of the current supplied to thecoil 1220. The controller may control the lens moving apparatus 1010 toperform an autofocus function and/or a handshake correction function.Furthermore, the controller may perform autofocus feedback controland/or handshake correction feedback control for the lens movingapparatus 1010.

In a modification shown in FIG. 30, the shapes of the printed circuitboard 1050 a and the sensor base 1070 a may be changed to as to bedifferent from the embodiment. The printed circuit board 1050 a may havea groove formed in the upper surface thereof, and the image sensor 1060may be disposed in the groove in the printed circuit board 1050 a. Thesensor base 1070 a may include the first surface 1071, at which thefilter 1030 is disposed, and the second surface 1072, which is disposedoutside the first surface 1071 and at a higher level than the firstsurface 1071. Here, the upper surface of the filter 1030 may be disposedat a level that is higher than the first surface 1071 of the sensor base1070 but is lower than the second surface 1072 of the sensor base 1070.The adhesive 1040 may project upwards above the second surface 1072 ofthe sensor base 1070.

Heretofore, the case in which the lens moving apparatus 1010 is an AFmodule has been described with reference to FIGS. 21 to 23. However, thelens moving apparatus 1010 may be an OIS module in a modification. In amodification, the lens moving apparatus 1010 may include the housing1110, the magnet 1120, the bobbin 1210, the coil 1220, the upper elasticmember 1310, the lower elastic member 1320, the base 1400 and the cover1500. The lens moving apparatus 1010 may further include the boarddisposed at the base 1400, the OIS coil formed at the board so as toface the magnet 1120, and a plurality of wires connecting the upperelastic member 1310 to the board.

The lens moving apparatus according to the embodiment may be included inan optical instrument, which is designed to form the image of an objectin a space using reflection, refraction, absorption, interference,diffraction or the like, which are characteristics of light, to extendeyesight, to record an image obtained through a lens or to reproduce theimage, to perform optical measurement, or to propagate or transmit animage. For example, although the optical instrument according to theembodiment may be a mobile phone, cellular phone, smart phone, portablesmart instrument, digital camera, laptop computer, digital broadcastingterminal, PDA (Personal Digital Assistant), PMP (Portable MultimediaPlayer), navigation device, or the like, the disclosure is not limitedthereto. Furthermore, any device capable of taking images or photographsis possible.

FIG. 31 is a perspective view illustrating a portable terminal 200Aaccording to an embodiment. FIG. 32 is a view illustrating theconfiguration of the portable terminal illustrated in FIG. 31.

Referring to FIGS. 31 and 32, the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an audio/video (A/V) input unit 720, a sensingunit 740, an input/output unit 750, a memory unit 760, an interface unit770, a controller 780, and a power supply unit 790.

The body 850 illustrated in FIG. 31 has a bar shape, without beinglimited thereto, and may be any of various types, such as, for example,a slide type, a folder type, a swing type, or a swivel type, in whichtwo or more sub-bodies are coupled so as to be movable relative to eachother.

The body 850 may include a case (a casing, housing, cover or the like)defining the external appearance of the terminal. For example, the body850 may be divided into a front case 851 and a rear case 852. Variouselectronic components of the terminal may be accommodated in the spacedefined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast-receiving module 711, amobile communication module 712, a wireless Internet module 713, anearfield communication module 714, and a location information module715.

The A/V input unit 720 serves to input audio signals or video signals,and may include, for example, a camera 721 and a microphone 722.

The camera 721 may include the camera module 200 or 1010A according tothe embodiment.

The sensing unit 740 may sense the current state of the terminal 200A,such as, for example, the opening or closing of the terminal 200A, thelocation of the terminal 200A, the presence of a user's touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. When the terminal 200A is, for example,a slide-type cellular phone, the sensing unit 740 may sense whether theslide-type cellular phone is opened or closed. Furthermore, the sensingunit 740 may sense the supply of power from the power supply unit 790,coupling of the interface unit 770 to an external device, and the like.

The input/output unit 750 serves to generate, for example, visual,audible, or tactile input or output. The input/output unit 750 maygenerate input data to control the operation of the terminal 200A, andmay display information processed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touchscreen panel 753. Thekeypad unit 730 may generate input data in response to input on akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich varies depending on the electrical signals applied thereto. Forexample, the display module 751 may include at least one among a liquidcrystal display, a thin-film transistor liquid crystal display, anorganic light-emitting diode, a flexible display and a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in, for example, a call-signal receptionmode, a call mode, a recording mode, a voice recognition mode, or abroadcast reception mode, or may output audio data stored in the memoryunit 760.

The touchscreen panel 753 may convert variation in capacitance, causedby a user's touch on a specific region of a touchscreen, into electricalinput signals.

The memory unit 760 may temporarily store programs for the processingand control of the controller 780, and input/output data (for example,telephone numbers, messages, audio data, stationary images, movingimages and the like). For example, the memory unit 760 may store imagescaptured by the camera 721, for example, pictures or moving images.

The interface unit 770 serves as a path through which the lens movingapparatus is connected to an external device connected to the terminal200A. The interface unit 770 may receive power or data from the externalcomponent, and may transmit the same to respective constituent elementsinside the terminal 200A, or may transmit data inside the terminal 200Ato the external component. For example, the interface unit 770 mayinclude a wired/wireless headset port, an external charger port, awired/wireless data port, a memory card port, a port for connection to adevice equipped with an identification module, an audio input/output(I/O) port, a video input/output (I/O) port, an earphone port and thelike.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to, for example, voice calls, data communication, and videocalls.

For example, the controller 780 may include a display controller 781 forcontrolling the display module 753. For example, the controller 780 mayinclude a camera controller 782 for controlling the camera 721.

The controller 780 may include a multimedia module 783 for multimediaplayback. The multimedia module 783 may be embodied in the controller780, or may be embodied separately from the controller 180.

The controller 780 may perform a pattern recognition process capable ofrecognizing writing input or drawing input carried out on a touch screenas a character and an image, respectively.

In place of the controller 830 of the camera module 200, the controller780 of the optical device 200A may send a clock signal SCL, a datasignal SDA and power signals VDD and GND for I2C communication with thefirst and second position sensors 170 and 240, and may receive the clocksignal SCL and the data signal SDA from the first and second positionsensors 170 and 240.

The power supply unit 790 may supply power required to operate therespective constituent elements upon receiving external power orinternal power under the control of the controller 780.

FIG. 33A is a block diagram of a portable terminal 200A according to anembodiment.

Referring to FIG. 33A, the camera module 200 may include the motionsensor, for example, the gyro sensor 820, but may not include thecontroller.

The portable terminal 200A may include the controller 780, and mayfurther include an additional gyro sensor 55, in addition to the gyrosensor 820 of the camera module 200.

Each of the first position sensor 170, the first sensor 240 a, and thesecond sensor 240 b may be embodied as a driver IC including a Hallsensor.

The driver of each of the first position sensor 170, the first sensor240 a and the second sensor 240 b of the camera module 200 may performdata communication, for example, I2C communication, with the controller780 of the portable terminal 200A.

The driver of each of the first position sensor 170, the first sensor240 a and the second sensor 240 b of the camera module 200 may includean analog-to-digital converter, configured to convert the output of theHall sensor (for example, 61A, 61B and 61C) into a digital signal.

The driver of each of the first position sensor 170, the first sensor240 a, and the second sensor 240 b of the camera module 200 may includea PID controller for performing phase compensation and/or gaincompensation for a digital signal of the output from the Hall sensorbased on the result of data communication (referred to as “PIDcontrol”).

For example, the driver of the first position sensor 170 may create afirst drive signal based on the output of the PID controller of thefirst position sensor 170, and may provide the first drive signal to thefirst coil 120 (referred to as “AF-Driving”).

For example, the driver of the first sensor 240 a may create a seconddrive signal based on the output of the PID controller of the firstsensor 240 a, and may provide the second drive signal to the coil units230-1 and 230-3 for the x-axis direction (referred to as “X-Driving”).

The driver of the second sensor 240 b may create a third drive signalbased on the output of the PID controller of the second sensor 240 b,and may provide the third drive signal to the coil units 230-2 and 230-4for the y-axis direction (referred to as “Y-Driving”).

FIG. 33B is a block diagram of a portable terminal 200A according toanother embodiment.

Referring to FIG. 33B, the camera module 200 may include the motionsensor, for example the gyro sensor 820. The portable terminal 200A mayinclude an additional gyro sensor 55, in addition to the gyro sensor 820of the camera module 200.

The portable terminal 200A may include the controller 780, and mayfurther include an additional controller 830, in addition to thecontroller 780 of the portable terminal 200A.

The driver of each of the first position sensor 170, the first sensor240 a and the second sensor 240 b of the camera module 200 may performdata communication, for example, I2C communication, with the controller820 of the camera module 200 and/or the controller 780 of the portableterminal 200A.

The “PID control”, “AF-Driving”, X-Driving” and “Y-Driving” mentioned inFIG. 33A may be applied to FIG. 33B, with or without modification.

In an embodiment in which the lens moving apparatus 1010 is an OISmodule, the description of FIGS. 33A and 33B may be applied to thecamera device 1010A shown in FIG. 21, with or without modification.

The features, configurations, effects and the like described above inthe embodiments are included in at least one embodiment, but theinvention is not limited only to the embodiments. In addition, thefeatures, configurations, effects and the like exemplified in therespective embodiments may be combined with other embodiments ormodified by those skilled in the art. Accordingly, content related tothese combinations and modifications should be construed as fallingwithin the scope of the disclosure.

INDUSTRIAL APPLICABILITY

The embodiments are applicable to a lens moving apparatus, a cameramodule, and an optical device, which are capable of increasing thelength of the support member without increasing the height thereof andthus of improving reliability and reducing power consumption.

1-10. (canceled)
 11. A lens moving apparatus comprising: a housing; abobbin disposed in the housing; a magnet disposed on the housing; afirst coil disposed on the bobbin and configured to move the bobbin byan interaction with the magnet; a sensing magnet disposed on the bobbin;a first position sensor disposed on the housing so as to correspond tothe sensing magnet; a second coil disposed under the magnet; a circuitboard comprising a first terminal and a second terminal; and a secondposition sensor including first and second sensors conductivelyconnected to the circuit board, wherein each of the first positionsensor and the first and second sensors is a driver IC including a Hallsensor and a driver.
 12. The lens moving apparatus according to claim11, wherein the first terminal of the circuit board is provided with aclock signal and the second terminal of the circuit board is providedwith a data signal, wherein the driver of each of the first positionsensor, the first sensor, and the second sensor transmits and receivesthe clock signal through the first terminal of the circuit board, andtransmits and receives the data signal through the second terminal ofthe circuit board.
 13. The lens moving apparatus according to claim 12,wherein the data signal includes a first data signal for the firstposition sensor, a second data signal for the first sensor, and a thirddata signal for the second sensor, and wherein the first data signal,the second data signal, and the third data signal are transmitted andreceived through the second terminal in a time-division manner.
 14. Thelens moving apparatus according to claim 12, wherein the circuit boardcomprises third and fourth terminals, and wherein the driver of each ofthe first position sensor, the first sensor, and the second sensor isprovided with a power signal through the third and fourth terminals. 15.The lens moving apparatus according to claim 14, wherein the powersignal includes a first voltage, which is supplied to the thirdterminal, and a second voltage, which is supplied to the fourth terminaland is higher than the first voltage.
 16. The lens moving apparatusaccording to claim 12, wherein the driver of each of the first positionsensor, the first sensor, and the second sensor uses data communicationusing a protocol, and wherein, in the data communication, the drivers ofthe first position sensor, the first sensor, and the second sensor areidentified by different addresses, and the data signal is transmittedand received to and from one of the first position sensor, the firstsensor, and the second sensor based on the different addresses.
 17. Thelens moving apparatus according to claim 12, wherein the magnet includesa first magnet and a second magnet, and the second coil includes a firstcoil unit corresponding to the first magnet and a second coil unitcorresponding to the second magnet.
 18. The lens moving apparatusaccording to claim 17, wherein the driver of the first sensor providesthe first coil unit with a first drive signal, and the driver of thesecond sensor provides the second coil unit with a second drive signal.19. The lens moving apparatus according to claim 18, wherein the driverof the first sensor provides the first coil unit with the first drivesignal through the circuit board, and the driver of the second sensorprovides the second coil unit with the second drive signal through thecircuit board.
 20. The lens moving apparatus according to claim 12,wherein the driver of the first position sensor provides the first coilwith a third drive signal.
 21. The lens moving apparatus according toclaim 20, comprising first and second elastic members coupled both tothe bobbin and to the housing, wherein the first coil is coupled to thefirst and second elastic members, and the drive signal is supplied tothe first coil through the first and second elastic members.
 22. Thelens moving apparatus according to claim 11, comprising a base disposedunder the circuit board, and wherein the first and second sensors aredisposed between the circuit board and the base.
 23. The lens movingapparatus according to claim 17, wherein the first sensor is overlappedwith the first magnet in an optical-axis direction and the second sensoris overlapped with the second magnet in the optical-axis direction. 24.The lens moving apparatus according to claim 11, wherein the housing isconfigured to move in a direction perpendicular to an optical-axisdirection by an interaction between the second coil and the magnet. 25.The lens moving apparatus according to claim 11, wherein the magnetcomprises four magnet units and the second coil comprises four coilunits corresponding to the four magnet units, and wherein the firstsensor is overlapped with one of the four magnet units in anoptical-axis direction and the second sensor is overlapped with anotherone of the four magnet units in the optical-axis direction.
 26. A lensmoving apparatus comprising: a housing; a bobbin disposed in thehousing; a magnet disposed on the housing; a first coil disposed on thebobbin and configured to move the bobbin by an interaction with themagnet; a second coil configured to move the housing in a directionperpendicular to an optical-axis direction by an interaction with themagnet; a circuit board comprising a first terminal and a secondterminal; and first and second sensors conductively connected to thecircuit board, wherein each of the first and second sensors is a driverIC including a Hall sensor and a driver, wherein the first terminal ofthe circuit board is provided with a clock signal and the secondterminal of the circuit board is provided with a data signal, whereinthe driver of each of the first sensor and the second sensor transmitsand receives the clock signal through the first terminal, and transmitsand receives the data signal through the second terminal in atime-division manner.
 27. The lens moving apparatus according to claim26, wherein the circuit board includes third and fourth terminals, andwherein the driver of each of the first and second sensors is providedwith a power signal through the third and fourth terminals.
 28. The lensmoving apparatus according to claim 26, wherein the magnet comprises afirst magnet and a second magnet, and the second coil comprises a firstcoil unit corresponding to the first magnet and a second coil unitcorresponding to the second magnet, and wherein the driver of the firstsensor provides the first coil unit with a first drive signal, and thedriver of the second sensor provides the second coil unit with a seconddrive signal.
 29. The lens moving apparatus according to claim 26,wherein the data signal includes a first data signal for the firstsensor and a second data signal for the second sensor, and wherein thefirst data signal and the second data signal are transmitted andreceived through the second terminal in a time-division manner.
 30. Acamera module comprising: the lens moving apparatus according to claim11; and a controller, wherein the controller performs an AF operation ofcontrolling movement of the lens moving apparatus in a direction of anoptical axis using the first data signal, and performs an OIS operationof controlling movement of the lens moving apparatus in a directionperpendicular to the optical axis using the second and third data.